Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Rex Lam"'
Autor:
Rex Lam, Eric L. Sandquist, Gail H. Schaefer, Christopher D. Farrington, John D. Monnier, Narsireddy Anugu, Cyprien Lanthermann, Robert Klement, Jacob Ennis, Benjamin R. Setterholm, Tyler Gardner, Stefan Kraus, Claire L. Davies, Jerome A. Orosz
Publikováno v:
The Astronomical Journal, Vol 166, Iss 1, p 29 (2023)
We present measurements of the interferometrically resolved binary star system 12 Com and the single giant star 31 Com in the cluster Coma Berenices. 12 Com is a double-lined spectroscopic binary system consisting of a G7 giant and an A3 dwarf at the
Externí odkaz:
https://doaj.org/article/ba7343c603ab47fca87b391537e1afbb
Autor:
Rex Lam, Jan K. Spelt
Publikováno v:
Quality and Reliability Engineering International. 23:503-513
The evaluation of the functional reliability of different designs is a common task and times to failure can be compared using the likelihood ratio test. In the microelectronics industry, as in many others, the high cost of testing places severe restr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed98eb8de0c2979852a0e31fe3430cce
https://doi.org/10.1002/qre.833
https://doi.org/10.1002/qre.833
Publikováno v:
Microelectronics Reliability. 46:574-588
Accelerated thermal cycling (ATC) has been widely used in the microelectronics industry for reliability assessment. ATC testing decreases life cycle test time by one or more of the following means: increasing the heating and cooling rate, decreasing
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fbc77e01ec614f87167c9b8ed833dcd7
https://doi.org/10.1016/j.microrel.2005.01.008
https://doi.org/10.1016/j.microrel.2005.01.008
Autor:
M. Agia, A. R. Zbrzezny, Doug D. Perovic, Jan K. Spelt, Polina Snugovsky, Yan Qi, Rex Lam, Hamid R. Ghorbani
Publikováno v:
Journal of Electronic Materials. 33:1497-1506
Leadless chip resistor (LCR) assemblies were manufactured using both traditional tin-lead (Sn37Pb) and lead-free (Sn3.8Ag0.7Cu) solders. The leadfree test vehicles were assembled using three different cooling rates: 1.6°C/sec, 3.8°C/sec, and 6.8°C
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::52411bfa862b245c01522369741a3019
https://doi.org/10.1007/s11664-004-0091-0
https://doi.org/10.1007/s11664-004-0091-0