Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Rex Anderson"'
Publikováno v:
2020 IEEE Radiation Effects Data Workshop (in conjunction with 2020 NSREC).
A Cobham Advanced Electronic Solutions SONOS based Nor Flash non-volatile memory has been designed, manufactured, and characterized for radiation effects. The radiation effects results will be presented.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5374fdebd0ed6a82b402713665f9121c
https://doi.org/10.1109/redw51883.2020.9325828
https://doi.org/10.1109/redw51883.2020.9325828
Autor:
Saffer, Rex Anderson
High signal-to-noise optical spectrophotometry of a sample of field subluminous B stars drawn largely from the Palomar Green ultraviolet excess survey is analyzed with a new grid of model atmospheres and synthetic spectra. The stellar effective tempe
Externí odkaz:
http://hdl.handle.net/10150/185635
Publikováno v:
2016 IEEE Radiation Effects Data Workshop (REDW).
The SEL and TID test results are presented for the Cobham radiation hardened bus switch family of products. The device is SEL immune to an effective LET ≤ 100 MeV·cm2/mg and TID qualified to 300krad(Si).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f16e78db54e4c9dc87fa0fd5b6cf72e7
https://doi.org/10.1109/nsrec.2016.7891735
https://doi.org/10.1109/nsrec.2016.7891735
Publikováno v:
2016 IEEE Radiation Effects Data Workshop (REDW).
The SEL, SEGR, SEB and TID test results are presented for the Cobham CAN FD Transceiver. The device is SEL, SEGR, and SEB immune to a LET ≤ 100 MeV·cm2/mg and TID qualified to 100krad(Si).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f3063a1b9527a97aa3411f0ab55df131
https://doi.org/10.1109/nsrec.2016.7891734
https://doi.org/10.1109/nsrec.2016.7891734
Publikováno v:
Microelectronics Reliability. 50:928-936
Through an aggressive product development program which includes experiment and simulation, Amkor has developed the next level of WLCSP (CSP nl ™), a product which exhibits superior board level reliability when subjected to drop impact, a strong re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::df4542b739773c296c6bdabb1a4651d4
https://doi.org/10.1016/j.microrel.2010.02.027
https://doi.org/10.1016/j.microrel.2010.02.027
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2010:002291-002311
Over the past few years, Wafer Level Chip Size Packages (WLCSPs) have gained widespread adoption, due to their ability to deliver higher performance at lower or equivalent costs when compared to competing packages. WLCSPs have been an excellent fit f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e2287ff6a765e8e5052b224963f8ef5
https://doi.org/10.4071/2010dpc-tha32
https://doi.org/10.4071/2010dpc-tha32
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
We present the results of study on the manufacturability and reliability of ALX211 polymer in wafer level packaging processes and structures. Previously, we studied the processing windows of ALX211 polymer, where process parameters were studied in la
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::13cd1f0476b42e7502ecf87aa953be9b
https://doi.org/10.1109/ectc.2010.5490725
https://doi.org/10.1109/ectc.2010.5490725
Publikováno v:
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Through an aggressive product development program which includes experiment and simulation, Amkor has developed the next level of WLCSP (CSPnl™), a product which exhibits superior board level reliability when subjected to drop impact, a strong requ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5c4121154f51d461f2f7d26df48fb612
https://doi.org/10.1109/esime.2009.4938518
https://doi.org/10.1109/esime.2009.4938518
Autor:
Hun Shen Ng, R. Moody, Tong Yan Tee, Long BinTan, Choong Peng Khoo, Jim Hee Low, Rex Anderson, Boyd Rogers
Publikováno v:
2008 10th Electronics Packaging Technology Conference.
The Wafer Level Chip Scale Package (WLCSP) is gaining popularity for its performance and for its ability to meet miniaturization requirements of portable consumer electronics, such as cell phones. Due to differential bending between the silicon die a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::42bd4b88f0452bedcead35c6061de45c
https://doi.org/10.1109/eptc.2008.4763574
https://doi.org/10.1109/eptc.2008.4763574
Autor:
Rex Anderson
Publikováno v:
New Scientist. 211:32
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2afbbbef9000378908744708ff69495e
https://doi.org/10.1016/s0262-4079(11)62215-x
https://doi.org/10.1016/s0262-4079(11)62215-x