Electroless Nickel and Immersion Gold deposition on Single Chips for Flip Chip Assembly of Pixel Detectors

Autor: Gädda, Akiko, Salonen, Jaakko, Suni, Tommi, Vähänen, Sami, Monnoyer, Philippe, Heikkinen, Hannele, Pohjonen, Harri

Publikováno v: Gädda, A, Salonen, J, Suni, T, Vähänen, S, Monnoyer, P, Heikkinen, H & Pohjonen, H 2011, Electroless Nickel and Immersion Gold deposition on Single Chips for Flip Chip Assembly of Pixel Detectors . in J Kutilainen (ed.), IMAPS Nordic Annual Conference 2011 . Curran Associates Inc., Finland, pp. 36-44, IMAPS Nordic Annual Conference 2011, Espoo, Finland, 5/06/11 .

Single chip handling has received significant attention for the diced chip without an Under Bump Metallization (UBM). In many cases, the Electroless Nickel Immersion Gold (ENIG) process is a suitable method to deposit UBM layer. Especially creating a

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=355e65625b88::9672cd65e340dd9c606f62f806c1f0bb
https://cris.vtt.fi/en/publications/94cba9cb-2fe3-4330-9649-eac172420e70

Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.