Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Revati Deshpande"'
Publikováno v:
International Journal of Sociology and Social Policy. 43:126-141
PurposeThe study aimed at understanding the relationship between psychological contract breach, well-being indicators, i.e. subjective well-being and mental well-being and innovative behaviour.Design/methodology/approachData were collected via a stru
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca532930195542bdd4370bf165054b58
https://doi.org/10.1108/ijssp-01-2022-0023
https://doi.org/10.1108/ijssp-01-2022-0023
Autor:
Shankar Durgam, Ajinkya Bhosale, Vivek Bhosale, Revati Deshpande, Pankaj Sutar, Subodh Kamble
Publikováno v:
Journal of The Institution of Engineers (India): Series C. 103:763-776
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d7ecd55171ddad1777905b9a64f8aac
https://doi.org/10.1007/s40032-022-00805-z
https://doi.org/10.1007/s40032-022-00805-z
Autor:
Ajinkya Bhosale, Vivek Bhosale, Subodh Kamble, Revati Deshpande, Pankaj Sutar, Shankar Durgam
Publikováno v:
Heat Transfer. 50:7817-7838
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::99005676e41a00a22d139373c951d7f7
https://doi.org/10.1002/htj.22255
https://doi.org/10.1002/htj.22255
Autor:
Vivek Bhosale, Pankaj Sutar, Subodha Kamble, Shankar Durgam, Ajinkya Bhosale, Revati Deshpande
Publikováno v:
2021 4th Biennial International Conference on Nascent Technologies in Engineering (ICNTE).
This paper uses machine learning algorithms as a viable alternative for simulation software for the electronic cooling problem to select a suitable configuration and minimize failures due to improper heat dissipation. A combination of machine learnin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c025efc8e821e8f1e1bd344fceff6a84
https://doi.org/10.1109/icnte51185.2021.9487663
https://doi.org/10.1109/icnte51185.2021.9487663
Autor:
Abhay D. Deshmukh, Garima Naik, Dilip Peshwe, Swamini Chopra, Revati Deshpande, Kavita A. Deshmukh
Publikováno v:
Applied Physics A. 125
Carbon nanotube (CNT)-reinforced polymer composites are steadily replacing other materials and finding their applications in many structural components. This has been credited to their light weight, ease of processing and extraordinary thermal, mecha
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2abdeba36f6696c5e5146c866109e726
https://doi.org/10.1007/s00339-019-3159-7
https://doi.org/10.1007/s00339-019-3159-7
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 1091:012005
This paper investigates the material selection for substrate board equipped with nine silicon heaters that mimic IC chips. This includes computational research on laminar forced convection air cooling of silicon IC chips in electronic components moun
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::689dca412d3140061a55805b7f91beeb
https://doi.org/10.1088/1757-899x/1091/1/012005
https://doi.org/10.1088/1757-899x/1091/1/012005
Publikováno v:
Thermal Science and Engineering Progress. 20:100725
This paper presents the novel concept of Support Vector Regression method for predicting the temperatures of rectangular heat sources with dummy components cooled by forced convection in a horizontal channel. The substrate board considered for study
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3929191def3587c0ef51b4e7292f3ac5
https://doi.org/10.1016/j.tsep.2020.100725
https://doi.org/10.1016/j.tsep.2020.100725
Autor:
Garima Naik, Swamini Chopra, Dilip Peshwe, Revati Deshpande, Kavita A. Deshmukh, Abhay D. Deshmukh
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 346:012004
Polybutylene Terephthalate (PBT) is a synthetic thermoplastic polymer with fast crystallization rate; and is extensively used in many automobile applications where it is prone to continuous wear. Carbon Nanotubes (CNTs) as reinforcements are most ide
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2898590f80b35925b4118e1f5c1a42b9
https://doi.org/10.1088/1757-899x/346/1/012004
https://doi.org/10.1088/1757-899x/346/1/012004
Autor:
Revati Deshpande, Garima Naik, Swamini Chopra, Kavita A. Deshmukh, Abhay D. Deshmukh, D. R. Peshwe
Publikováno v:
IOP Conference Series: Materials Science & Engineering; May2018, Vol. 346 Issue 1, p1-1, 1p