Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Renuka Vallabhaneni"'
Autor:
Nikhilesh Chawla, Ehsan Izadi, Renuka Vallabhaneni, Sudhanshu S. Singh, C. Shashank Kaira, Jagannathan Rajagopalan, Carl R. Mayer
Publikováno v:
Microelectronics Reliability. 79:314-320
Tin and tin-alloyed electroplated films are known to be susceptible to whisker growth under a range of conditions, many of which result in the generation of compressive stresses in the film. Compressive stress is considered to be one of the primary c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe093f3d330ff295f020ef3520b9a8fb
https://doi.org/10.1016/j.microrel.2017.07.042
https://doi.org/10.1016/j.microrel.2017.07.042
Publikováno v:
JOM. 68:2879-2887
Decreasing pitch size in electronic packaging has resulted in a drastic decrease in solder volumes. The Sn grain crystallography and fraction of intermetallic compounds (IMCs) in small-scale solder joints evolve much differently at the smaller length
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b91e381ee3106d3917d0d03731206621
https://doi.org/10.1007/s11837-016-2042-7
https://doi.org/10.1007/s11837-016-2042-7