Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Renqiang Zhu"'
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 12, Pp 318-321 (2024)
This letter reports a high-performance fully-vertical GaN-on-SiC p-i-n diode enabled by a conductive n-AlGaN buffer. The buffer conductivity was optimized by tuning the Al composition. The diode presents an ultra-low specific ON-resistance of 0.25 $\
Externí odkaz:
https://doaj.org/article/ba973af1a55f4af3988a3ac38c75d29c
Autor:
Xinke Liu, Bo Li, Junye Wu, Jian Li, Wen Yue, Renqiang Zhu, Qi Wang, Xiaohua Li, Jianwei Ben, Wei He, Hsien-Chin Chiu, Ke Xu, Ze Zhong
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 12, Pp 34-38 (2024)
In this work, vertical gallium nitride (GaN) trench Junction Barrier Schottky (JBS) diodes fabricated with a novelty slanted p-GaN sidewall on a 2-inch free-standing GaN (FS-GaN) substrate were demonstrated. The slanted sidewall on edge of devices wa
Externí odkaz:
https://doaj.org/article/79609d040551497caca4c2378ca79524
Publikováno v:
IEEE Electron Device Letters. 43:346-349
Publikováno v:
IEEE Electron Device Letters. 42:970-973
In this letter, we report the influence of p-GaN body doping concentration on the ON-state performance of vertical GaN trench MOSFETs. Decreasing the p-GaN body doping concentration leads to an enhanced maximum drain current ( ${I} _{D,\max}$ ), redu
Publikováno v:
IEEE Transactions on Electron Devices. 68:653-657
In this article, we demonstrate normally-OFF p-GaN gate high electron mobility transistors (HEMTs) on Si with an ultrahigh breakdown voltage ( ${V}_{BR}$ ) and excellent saturation drain current. Benefiting from the optimized material growth of high-
Publikováno v:
2022 Compound Semiconductor Week (CSW).
Publikováno v:
Applied Physics Express. 15:121004
This work reports GaN quasi-vertical trench MOSFETs grown on 6-inch Si substrates. The device with single-trench design shows a specific ON-resistance of 0.84 mΩ·cm2, a maximum drain current density of 5.0 kA cm−2, and a breakdown voltage of 320
Publikováno v:
IEEE Electron Device Letters. 40:530-533
In this letter, we report high-performance p-GaN HEMTs on Si with robust gate operation. For the first time, the preserved OFF-state drain blocking capability has been demonstrated in p-GaN HEMTs after forward gate breakdown. Benefitting from the red
Publikováno v:
Applied Physics Letters. 120:242104
Vertical GaN trench MOSFETs have shown enormous potential for efficient power switching applications. Low ON-resistance ( RON) to minimize power loss, high output current ( ION) to maximize driving capability, and large threshold voltage ( Vth) to av