Zobrazeno 1 - 10
of 70
pro vyhledávání: '"Renata Melamud"'
Publikováno v:
IEEE Sensors Journal. 13:987-993
The frequency stability of single-crystal silicon microelectromechanical systems resonators encapsulated with epitaxial polysilicon (epi-seal) is investigated. As silicon resonators have significant temperature dependence, the inherent frequency stab
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3393c5a292440c05a53d61883a9bda4a
https://doi.org/10.1109/jsen.2012.2227708
https://doi.org/10.1109/jsen.2012.2227708
Autor:
Thomas W. Kenny, Bongsang Kim, James Christian Salvia, Renata Melamud, Hyung Kyu Lee, Matthew A. Hopcroft
Publikováno v:
Journal of Microelectromechanical Systems. 20:1355-1365
Electrostatic tuning of the frequency in micromachined Si-SiO2 composite resonators for temperature compensation is demonstrated and analyzed. Electrostatic tuning exploits the bias voltage dependence of frequency for the compensation. Si-SiO2 compos
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::70994edbd43020e0e0364574ab93f608
https://doi.org/10.1109/jmems.2011.2168083
https://doi.org/10.1109/jmems.2011.2168083
Autor:
Gaurav Bahl, James Christian Salvia, Thomas W. Kenny, Roger T. Howe, Bongsang Kim, Renata Melamud
Publikováno v:
Journal of Microelectromechanical Systems. 20:355-364
This paper proposes the use of ac polarization for resonant electrostatic microelectromechanical systems that eliminates the frequency drift caused by dielectric charging and charge screening. It is mathematically and experimentally shown that an ac-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e482aa7364f8f7acead31706e1b6234a
https://doi.org/10.1109/jmems.2010.2100027
https://doi.org/10.1109/jmems.2010.2100027
Autor:
Renata Melamud, Thomas W. Kenny, Shasha Wang, Kuan-Lin Chen, James Christian Salvia, Roger T. Howe
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 1:310-317
This paper presents an integrated solution for wafer-level packaging and electrostatic actuation of out-of-plane radio frequency microelectromechanical system resonators. By integrating the electrodes into the epitaxial-grown silicon layer, both the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8612b293deb909ffc99aa6692597c58e
https://doi.org/10.1109/tcpmt.2010.2100711
https://doi.org/10.1109/tcpmt.2010.2100711
Autor:
Roger T. Howe, R.G. Hennessy, Gaurav Bahl, Bongsang Kim, David Elata, Rob N. Candler, Matthew A. Hopcroft, Thomas W. Kenny, Saurabh A. Chandorkar, James Christian Salvia, Renata Melamud
Publikováno v:
Journal of Microelectromechanical Systems. 19:162-174
This paper investigates the effects of dielectric charge on resonant frequency in thermally oxidized silicon resonators hermetically encapsulated using ?epi-seal.? SiO2 coatings are effective for passive temperature compensation of resonators but mak
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::34bd77bb26d3425a6b052c1896bcbaf2
https://doi.org/10.1109/jmems.2009.2036274
https://doi.org/10.1109/jmems.2009.2036274
Publikováno v:
Journal of Microelectromechanical Systems. 19:192-201
We present a new temperature compensation system for microresonator-based frequency references. It consists of a phase-locked loop (PLL) whose inputs are derived from two microresonators with different temperature coefficients of frequency. The reson
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7ef092f117474c0e06c00a9950418081
https://doi.org/10.1109/jmems.2009.2035932
https://doi.org/10.1109/jmems.2009.2035932
Autor:
Thomas W. Kenny, M.W. Messana, Bongsang Kim, Andrew B. Graham, Roger T. Howe, Peter G. Hartwell, S. Yoneoka, J. Provine, Renata Melamud
Publikováno v:
Journal of Microelectromechanical Systems. 19:28-37
Packaging of microelectromechanical systems (MEMS) is a critical step in the transition from development to commercialized product. This paper presents a thin-film encapsulation process that allows varying trench widths suitable for MEMS devices with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::737634064d31afa0f69f82d80cd8cb30
https://doi.org/10.1109/jmems.2009.2035717
https://doi.org/10.1109/jmems.2009.2035717
Autor:
Renata Melamud, Bongsang Kim, Thomas W. Kenny, Hyung Kyu Lee, Saurabh A. Chandorkar, Gaurav Bahl, Matthew A. Hopcroft, James Christian Salvia
Publikováno v:
Journal of Microelectromechanical Systems. 18:1409-1419
Utilizing silicon and silicon dioxide's opposing temperature coefficients of Young's modulus, composite resonators with zero linear temperature coefficient of frequency are fabricated and characterized. The resulting resonators have a quadratic tempe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b010fcb1a7c26c1b1e8265fc39cd066
https://doi.org/10.1109/jmems.2009.2030074
https://doi.org/10.1109/jmems.2009.2030074
Autor:
M. Agarwal, Renata Melamud, Saurabh A. Chandorkar, C.M. Jha, Thomas W. Kenny, Rob N. Candler, Bongsang Kim, Gary Yama, Matthew A. Hopcroft
Publikováno v:
Journal of Microelectromechanical Systems. 17:755-766
The temperature dependence of the quality factor of microelectromechanical system (MEMS) resonators is analyzed and measured. For silicon MEMS resonators, there are several energy loss mechanisms that determine the quality factor. These include air-d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cacf2deec3c7d685675e91d0c79299ae
https://doi.org/10.1109/jmems.2008.924253
https://doi.org/10.1109/jmems.2008.924253
Autor:
Rob N. Candler, James Christian Salvia, Saurabh A. Chandorkar, Thomas W. Kenny, Manu Agarwal, Bongsang Kim, Matthew A. Hopcroft, Renata Melamud, C.M. Jha
Publikováno v:
Journal of Microelectromechanical Systems. 17:175-184
This paper presents an in-chip thermal-isolation technique for a micro-ovenized microelectromechanical-system resonator. Resonators with a microoven can be used for high-precision feedback control of temperature to compensate for the temperature depe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b8e1cf468288924e5a3b2c6b69f5c6b1
https://doi.org/10.1109/jmems.2007.904332
https://doi.org/10.1109/jmems.2007.904332