Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Remi Pantou"'
Autor:
Bernhard Wunderle, Tuhin Sinha, Mario Baum, Brian R. Burg, Xi Chen, Christian Hofmann, Florian Schindler-Saefkow, Gerd Schlottig, Rahel Strassle, Thomas Brunschwiler, Remi Pantou, Severin Zimmermann, Uwe Zschenderlein, Albert Achen, Sridhar Kumar, Jonas Zurcher, Marie Haupt
Publikováno v:
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Heat dissipation from 3D chip stacks can cause large thermal gradients due to the accumulation of dissipated heat and thermal interfaces from each integrated die. To reduce the overall thermal resistance and thereby the thermal gradients, this public
Autor:
Thomas Brunschwiler, Gerd Schlottig, Remi Pantou, Sven Rzepka, Bernhard Wunderle, Florian Schindler-Saefkow, Sridhar Kumar, Juergen Keller
Publikováno v:
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Finite Element Simulations of highly integrated and large electronics packages with detailed elastic-plastic material modeling of thousands of solder balls are still challenging tasks for today's computation systems. The complex geometry and mesh and
Publikováno v:
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
The determination of the mechanical and thermo-mechanical behaviour of a UHF-RFID-based smart system embedded in a transmission belt has been the goal of the work reported in this paper. The complex bending and thermal loads occurring during fabricat
Autor:
I. Maus, Bruno Michel, Markus Fink, Kaspar M. B. Jansen, Bernhard Wunderle, Remi Pantou, H. Preu, M. Niessner
Publikováno v:
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Microelectronic devices integrate more and more diverse materials in order to miniaturize the packages. Epoxy resins enable smaller electronic devices with promising features [1]. The performance and the reliability of the product are highly dependen
Publikováno v:
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
More and more functionalities will soon be integrated into lightweight structures made of fiber reinforced polymers (FRP). This combines very different materials in minimum space. Consequently, thermo-mechanical risks are of vital concern. The comple
Publikováno v:
2012 International Semiconductor Conference Dresden-Grenoble (ISCDG).
Micro and nano functional systems like MEMS and smart systems are exposed to complex and very challenging service conditions (e.g., within airframe structures or in automotive applications under the hood or within battery cells). Therefore, long-term
Publikováno v:
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
The paper addresses the determination of the effects of time and temperature on strength and lifetime of structural polymer composites. For some time, this topic has already concerned the aerospace industry during their fatigue tests of light structu