Výsledky vyhledávání - "Rejean Paul Levesque"

Module final test open yield optimization, of high lead flip chip on large organic package, using structured problem solving approach

Autor: Rejean Paul Levesque, Sylvain Pharand, Valerie Oberson, Sylvain Ouimet

Publikováno v: 2009 59th Electronic Components and Technology Conference.

The Flip Chip Plastic Ball Grid Array (FCPBGA) has become the prevalent packaging solution for mainstream microprocessors and high performance Asics. Increases in device size for these applications have begun to push the limits in terms of bond and a

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::612ac9592813afe132a28226a936e014
https://doi.org/10.1109/ectc.2009.5074093

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