Zobrazeno 1 - 10
of 48
pro vyhledávání: '"Reinhard Pufall"'
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::50ec7226cc2895d018a49ba089f0c959
https://doi.org/10.1109/eurosime54907.2022.9758840
https://doi.org/10.1109/eurosime54907.2022.9758840
Autor:
Dominik Udiljak, Reinhard Pufall, Georg M. Reuther, Jamila Boudaden, Peter Ramm, Gabriele Schrag
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28cfd4a2c0fefbc7493ec68b5baf031c
https://doi.org/10.1109/eurosime54907.2022.9758867
https://doi.org/10.1109/eurosime54907.2022.9758867
Autor:
Nathanael Johrmann, Valentina Osipova, Sebastian Breitenreiner, Reinhard Pufall, Bernhard Wunderle
Publikováno v:
2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7946f7138966ca08c62cc9e8b298d944
https://doi.org/10.1109/therminic52472.2021.9626510
https://doi.org/10.1109/therminic52472.2021.9626510
Autor:
Michael Goroll, Dominik Udiljak, Reinhard Pufall, Bernhard Wunderle, Georg M. Reuther, Nadine Pflugler
Publikováno v:
Microelectronics Reliability. 99:177-185
Interfacial delamination in semiconductor packages during their lifetime is a reliability risk. For the realisation of a “Design for Reliability” approach, the whole product needs to be studied virtually using Finite Element simulations. Only thi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::137143d79759277f0c10e8599291683a
https://doi.org/10.1016/j.microrel.2019.06.001
https://doi.org/10.1016/j.microrel.2019.06.001
Autor:
Bernhard Wunderle, Tomasz Bieniek, V. Osipova, N. Johrmann, J. Heilmann, Reinhard Pufall, J. Arnold, Daniel May
Publikováno v:
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
We use Si MEMS cantilevers as sample carriers to gain high cycle fatigue data for thin metal films by accelerated stress testing. A typical number of 107 cycles can thus be achieved in a couple of hours. A closed loop control using laser beam deflect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::caa7a9c97d3652ac4016520eb5db9618
https://doi.org/10.1109/eurosime52062.2021.9410876
https://doi.org/10.1109/eurosime52062.2021.9410876
Publikováno v:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
In modern microelectronic devices, mechanical robustness and reliability have become more and more challenging, which is mainly due to continuous shrinkage of dimensions. At the same time a wide variety of thin film materials – metals, ceramics and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8537da93012e0699f0ce78961d8cce8e
https://doi.org/10.1109/eurosime48426.2020.9152755
https://doi.org/10.1109/eurosime48426.2020.9152755
Publikováno v:
ECS Meeting Abstracts. :628-628
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cbfa0162537dbe95b914c6e25447c2d5
https://doi.org/10.1149/ma2021-0212628mtgabs
https://doi.org/10.1149/ma2021-0212628mtgabs
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
We explore the capabilities of creep testing for the reliability and robustness assessment of die attach layers within this paper. To this end we conducted finite element simulations and experiments. We optimised our setup in terms of thermal stabili
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5a293494ef820535b71e231e6e409e5b
https://doi.org/10.23919/empc44848.2019.8951792
https://doi.org/10.23919/empc44848.2019.8951792
Publikováno v:
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Different test methods are used within the microelectronics community to quantify adhesion of material combinations interacting inside the package. Button Shear Tests or Bending Tests are popular test methods for studying moulding compound adhesion o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a3ade28bb7da54bf965668cce119dc64
https://doi.org/10.1109/eurosime.2019.8724566
https://doi.org/10.1109/eurosime.2019.8724566
Autor:
Bernhard Wunderle, Daniel May, Georg M. Reuther, Nadine Pflugler, Dominik Udiljak, Reinhard Pufall
Publikováno v:
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Thermo-mechanical stress caused by the mismatch of coefficients of thermal expansion (CTE) and temperature variations remain a major concern for the reliability of semiconductor components. Over the last decade a lot of effort was spent to find solut
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b61c5d7682a1057910fb00511d308135
https://doi.org/10.1109/eurosime.2019.8724551
https://doi.org/10.1109/eurosime.2019.8724551