Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Reggie Phillips"'
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2018:000138-000142
For applications using Wide Band Gap (WBG) semiconductors, and for electronics for down-hole drilling, oil exploration, geothermal energy generation and power electronics, there is a growing need for capacitors that have robust reliability at tempera
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b8210681ce58d6632e3baef1de92247
https://doi.org/10.4071/2380-4491-2018-hiten-000138
https://doi.org/10.4071/2380-4491-2018-hiten-000138
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:000290-000298
For applications such as electronics for down-hole drilling and exploration, geothermal energy generation and power electronics, there is a growing need for capacitors that have robust reliability at temperatures of 150°C or above. Conventional X7R
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6ad63ad2111f42c41edd5eab36f6ada6
https://doi.org/10.4071/2016-hitec-290
https://doi.org/10.4071/2016-hitec-290
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2015:000134-000141
There is a growing need for capacitors for applications at temperatures of 150°C or above, such as electronics for down-hole drilling and exploration, geothermal energy generation and power electronics. Conventional X7R and X8R type ceramic capacito
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b41ad4dda002a52afd71fc25ac5a9dc1
https://doi.org/10.4071/hiten-session4-paper4_3
https://doi.org/10.4071/hiten-session4-paper4_3
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2014:000121-000128
There is a growing need for ceramic capacitors for applications at temperatures of 150°C or above, such as electronics for down-hole drilling and exploration, geothermal energy generation and power electronics. Conventional X7R and X8R type ceramic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1f5bc35fa329a353b5d7d7931c714c6d
https://doi.org/10.4071/hitec-tp24
https://doi.org/10.4071/hitec-tp24
Publikováno v:
2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).
Multilayer ceramic capacitors manufactured with different designs using a C0G Ni BME technology are evaluated as building blocks for DC-Link capacitors. Electrical and physical properties are compared to a commercially available DC-Link ceramic capac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3931786166ddf4bd99c0ee1e7b785e52
https://doi.org/10.1109/3dpeim.2016.7570580
https://doi.org/10.1109/3dpeim.2016.7570580