Impact of RFIC integration of system and subsystem blocks on MCM solutions

Autor: Reedy, Ronald E., Camparini, Massimo Claudio

Publikováno v: Reedy, Ronald E. ; Camparini, Massimo Claudio (2005) Impact of RFIC integration of system and subsystem blocks on MCM solutions. In: Gallium Arsenide applications symposium. GAAS 2005, 3-7 ottobre 2005, Parigi.

Wireless systems of all types, from mobile phones to satellites have developed based on a combination of integrated circuits (IC) and multi chip modules (MCM). Digital sections of these systems have benefited from increasing levels of integration at

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4c1e7679939850bc8554b411b54d1c4d

Application of UTSi® CMOS On Sapphire to RF and Mixed Signal Requirements in Advanced Space Systems

Autor: Reedy, Ronald E.

Publikováno v: Reedy, Ronald E. (2002) Application of UTSi® CMOS On Sapphire to RF and Mixed Signal Requirements in Advanced Space Systems. In: Gallium Arsenide applications symposium. GAAS 2002, 23-27 september 2002, Milano.

Modern satellite systems require integrated circuits capable of meeting demanding radiation, performance, power consumption, price and integration requirements. As satellite systems evolve to large digital payloads and phased array antennae, highly i

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c7feed8712c52f9ca61ea03331082e31
http://amsacta.unibo.it/114/

Parallel interconnect components for optical modules utilizing flip-chip VCSEL on ultra-thin silicon-on-sapphire substrate.

Autor: Thai, Serey, Kuznia, Charles, Divakar, M. P., Albares, Donald J., Pendleton, Mike, Le, Tri, Bachta, Paul M., Hagan, Rick, Pommer, Dick, Cable, Jim, Reedy, Ronald E.

Publikováno v: Proceedings of SPIE; Nov2002, Issue 1, p230-235, 6p

Thin (100 nm) SOS for Application to Beyond VLSI Microelectronics.

Autor: Reedy, Ronald E., Garcia, Graham A.

Publikováno v: MRS Online Proceedings Library; 01/08/1988, Vol. 107, pN.PAG-1, 1p

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