Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Rebekah Sheraw"'
Autor:
Joseph F. Shepard, Henrik Johanson, Vandana Venkatasubramanian, Jay Mody, Takmeel Qanit, Ashwini Chandrasekar, Eswar Ramanathan, Craig Child, AnbuSelvam Km Mahalingam, Lei Jiang, Brett T. Cucci, Alycia Roux, O'brien Brendan, Christa Montgomery, Bradley Morganfeld, Keith Donegan, Colin Bombardier, Sang-Kee Eah, Vijaya Rana, Ghosh Somnath, Daniel Damjanovic, Anirvan Sircar, Zhiguo Sun, Singh Sunil K, Rebekah Sheraw, Ordonio Christopher, Silvestre MaryClaire, Adam DaSilva
Publikováno v:
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
As technology scaling continues, the selection of materials for sacrificial hard masks become very critical. Sacrificial hard masks are thin films that are used for patterning or protecting critical underlying films from damage during various process
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b80f0efb35ac3f6be7ae230059a989a
https://doi.org/10.1109/asmc.2019.8791788
https://doi.org/10.1109/asmc.2019.8791788
Autor:
Vickie Jophlin-Gut, Edward Sherwood, Laura Bauman, Rebekah Sheraw, Chienfan Yu, Michael Carbonnell, Katherine Hawkins, Zoey Sowinski, Ryan Kelly, Garrett Oakley
Publikováno v:
2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Process queue time control is a trade-off between defect and tool utilization. Three cases of queue time sensitivity discovered in active silicon (RX) module in our fab are discussed in this paper which led us to take a more pro-active approach to im
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::65785c02f30f986c1d7c02160cb7296b
https://doi.org/10.1109/asmc.2018.8373185
https://doi.org/10.1109/asmc.2018.8373185
Autor:
Cathy Gow, Edward Crawford, Yongchun Xin, Kan Zhang, Jang Sim, Fan Zheng, Dave Salvador, Rebekah Sheraw, Ben Stahl, Bryan Rhoads, Ishtiaq Ahsan, Brett Engel, Amanda L. Tessier, Xiao Pan, Brad Austin, Lori Kermel, William Davies
Publikováno v:
2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
In the state of the art development of chip manufacturing (FinFet technology for example) both optical inspection and inline electrical test are deployed to monitor and facilitate the process development. While optical inspection provides critical pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b735df40ec4c5974d6c4b406d8f530a
https://doi.org/10.1109/asmc.2016.7491094
https://doi.org/10.1109/asmc.2016.7491094