Zobrazeno 1 - 2
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pro vyhledávání: '"Rebecca C. Leghziel"'
Autor:
Simone Frasca, Rebecca C. Leghziel, Ivo N. Arabadzhiev, Benoît Pasquier, Grégoire F. M. Tomassi, Sandro Carrara, Edoardo Charbon
Publikováno v:
Scientific Reports, Vol 11, Iss 1, Pp 1-6 (2021)
Abstract We present here, for the first time, a fabrication technique that allows manufacturing scallop free, non-tapered, high aspect ratio in through-silicon vias (TSVs) on silicon wafers. TSVs are among major technology players in modern high-volu
Externí odkaz:
https://doaj.org/article/63513650693f4fa984e3e79944393796
Autor:
Ivo N. Arabadzhiev, Rebecca C. Leghziel, Edoardo Charbon, Benoît Pasquier, Simone Frasca, Sandro Carrara, Grégoire F. M. Tomassi
Publikováno v:
Scientific Reports, Vol 11, Iss 1, Pp 1-6 (2021)
Scientific Reports
Scientific Reports
We present here, for the first time, a fabrication technique that allows manufacturing scallop free,non-tapered, high aspect ratio in through-silicon vias (TSVs) on silicon wafers. TSVs are among major technology players in modern high-volume manufac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::50a21606d8f6476ca47169b5597ce169
https://doi.org/10.1038/s41598-021-83546-w
https://doi.org/10.1038/s41598-021-83546-w