Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Razvan Ungurelu"'
Autor:
Gaudentiu Varzaru, Razvan Ungurelu, Mihai Branzei, Bogdan Mihailescu, Ciprian Ionescu, Paul Svasta
Publikováno v:
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b82dc8e608d6a4ad597ce962acc11b9f
https://doi.org/10.1109/siitme53254.2021.9663595
https://doi.org/10.1109/siitme53254.2021.9663595
Autor:
Razvan Ungurelu, Gaudentiu Varzaru, Simona Gheorghe, Marin Gheorghe, Mihai Branzei, Ciprian Ionescu, Bogdan Mihailescu, Paul Svasta
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
A study was conducted on increasing the current carrying capability of conductor tracks made of electrically conductive composite materials to know the limitations when used in the manufacture of electronic modules by additive techniques. Conductor t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::547fc8688ca917e7bea105d38d1e05cd
https://doi.org/10.1109/isse51996.2021.9467606
https://doi.org/10.1109/isse51996.2021.9467606
Publikováno v:
2020 7th International Conference on Energy Efficiency and Agricultural Engineering (EE&AE).
The paper presents some aspects of practical deployment of an Internet-of-Things network on a large agricultural area in South West of Romania. Data from sensors detecting soil and air parameters are gathered by local stations and must be available o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2a06891314b1bf367eee113efa4c6a53
https://doi.org/10.1109/eeae49144.2020.9279019
https://doi.org/10.1109/eeae49144.2020.9279019
Autor:
Mihai Branzei, Bogdan Mihailescu, Gaudentiu Varzaru, Marin Gheorghe, Ciprian Ionescu, Paul Svasta, Razvan Ungurelu
Publikováno v:
2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME).
The paper presents the investigation of composite structures made by overlapping two or more layers of resins, including conductive resins, at different time intervals, as well as different temperatures. This situation occurs in the case of a model o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c9c94e197b2bccd7f91fefe03381ac7b
https://doi.org/10.1109/siitme50350.2020.9292289
https://doi.org/10.1109/siitme50350.2020.9292289
Publikováno v:
2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME).
The paper presents a solution to control the temperature and humidity in a greenhouse. A previous implementation was based on the exchange of air masses between the interior and exterior of the greenhouse. But it was difficult to obtain a lower and s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::69fbe507332bf7ab48df0fc707310997
https://doi.org/10.1109/siitme47687.2019.8990886
https://doi.org/10.1109/siitme47687.2019.8990886
Publikováno v:
2019 11th International Conference on Electronics, Computers and Artificial Intelligence (ECAI).
The paper presents the results of the simultaneous determinations carried out on the same gaseous media, on the one hand with a sensor measuring CO 2 concentration, and on the other with a digital gas sensor which, based on intelligent algorithms, pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::952113e81d27860b9eed2a2f5dabf38e
https://doi.org/10.1109/ecai46879.2019.9042113
https://doi.org/10.1109/ecai46879.2019.9042113
Considerations Regarding Computer Aided Design of a Structure to be Manufactured in Occam Technology
Publikováno v:
2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME).
There are 10 years since the enunciation of a new electronic manufacturing technology that no longer uses soldering alloy, Occam technology. The new technology comes with significant changes in the way the electronic modules are made because two proc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6260f3ffd373a74e0c056f01d20074e5
https://doi.org/10.1109/siitme.2018.8599201
https://doi.org/10.1109/siitme.2018.8599201
Publikováno v:
2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME).
Atmospheric temperature and humidity are parameters of great interest in precision agriculture or air quality assessment in urban agglomerations. The emergent technology of Internet of Things comes with the possibility of obtaining information from t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8eeeb440c540ba49de1885f707c22e95
https://doi.org/10.1109/siitme.2018.8599263
https://doi.org/10.1109/siitme.2018.8599263
Publikováno v:
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME).
One of the directions addressed by the SmartCity concept is traffic management. The growth of the population and of the number of cars in urban areas requires traffic management in order to reduce fuel loss, exhaust emissions, to eliminate time consu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5e74fb6b434685a3fb7f2aa49d173d12
https://doi.org/10.1109/siitme.2017.8259937
https://doi.org/10.1109/siitme.2017.8259937
Publikováno v:
2017 9th International Conference on Electronics, Computers and Artificial Intelligence (ECAI).
Because air pollution had a negative influence on the environment and human health, monitoring its quality has become a necessity. The air quality index is measured on different scales using data collected from devices that are sensitive to 3 up to 8
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::873cd6c37c2c7cf967d2d146b76e53d7
https://doi.org/10.1109/ecai.2017.8166462
https://doi.org/10.1109/ecai.2017.8166462