Zobrazeno 1 - 10
of 55
pro vyhledávání: '"Razaidi Hussin"'
Publikováno v:
2022 IEEE 20th Student Conference on Research and Development (SCOReD).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8be7b47075bfd371f249843af1bc4f35
https://doi.org/10.1109/scored57082.2022.9974097
https://doi.org/10.1109/scored57082.2022.9974097
Publikováno v:
2022 IEEE 20th Student Conference on Research and Development (SCOReD).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ab4153ba27201c05e8717a720b589aa
https://doi.org/10.1109/scored57082.2022.9974012
https://doi.org/10.1109/scored57082.2022.9974012
Publikováno v:
2022 IEEE International Conference on Semiconductor Electronics (ICSE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d78f60c48e68b24572bd50657118f663
https://doi.org/10.1109/icse56004.2022.9863178
https://doi.org/10.1109/icse56004.2022.9863178
Autor:
Chawalit Udom Sak, Siti Zarina Md Naziri, Rizalafande Che Ismail, Mohd Nazrin Md Isa, Razaidi Hussin
Publikováno v:
2022 IEEE International Conference on Semiconductor Electronics (ICSE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::328efeaca26f06eda22d918fe90645f5
https://doi.org/10.1109/icse56004.2022.9863201
https://doi.org/10.1109/icse56004.2022.9863201
Testing embedded memories in a chip can be very challenging due to their high-density nature and manufactured using very deep submicron (VDSM) technologies. In this review paper, functional fault models which may exist in the memory are described, in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cee6a8ea9d55124f031e373715b2f10a
https://zenodo.org/record/5909142
https://zenodo.org/record/5909142
Publikováno v:
2021 IEEE Asia Pacific Conference on Circuit and Systems (APCCAS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2765601bc01083b14044d8cfe3609c19
https://doi.org/10.1109/apccas51387.2021.9687791
https://doi.org/10.1109/apccas51387.2021.9687791
Publikováno v:
2021 IEEE Asia Pacific Conference on Circuit and Systems (APCCAS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::62ca0e4f7979478d1149d8fa598b6ac1
https://doi.org/10.1109/apccas51387.2021.9687806
https://doi.org/10.1109/apccas51387.2021.9687806
Publikováno v:
2021 IEEE International Conference on Sensors and Nanotechnology (SENNANO).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::070108769a48548fa8d701161ed8098e
https://doi.org/10.1109/sennano51750.2021.9642560
https://doi.org/10.1109/sennano51750.2021.9642560
Publikováno v:
2021 IEEE International Conference on Sensors and Nanotechnology (SENNANO).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2edb21b16c79236943796f56aa20c791
https://doi.org/10.1109/sennano51750.2021.9642685
https://doi.org/10.1109/sennano51750.2021.9642685
Interpolation is another important procedure for logarithmic number system (LNS) addition and subtraction. As a medium of approximation, the interpolation procedure has an urgent need to be enhanced to increase the accuracy of the operation results.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::94caa0a2a1214b3caba2e9461d44e731
https://zenodo.org/record/7104375
https://zenodo.org/record/7104375