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pro vyhledávání: '"Raymond C. Parkes"'
Autor:
Pekka Turpeinen, L.P. Lehman, Mattt A. Korhonen, Karl J. Puttlitz, Brian Bowman, Donald W. Henderson, George H. Thiel, Raymond C. Parkes, Tia-Marje K. Korhonen
Publikováno v:
Journal of Electronic Materials. 33:1581-1588
The deformation properties of near-eutectic Sn-Ag-Cu alloy were measured in temperatures ranging from −25 to 125°C, and down to strain rates of about 10×10−9. Results have been combined into a stress versus strain rate master curve. The measure
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e445ec529bd7db4cbc21200cd86d90c4
https://doi.org/10.1007/s11664-004-0101-2
https://doi.org/10.1007/s11664-004-0101-2
