Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Raquel Fundan"'
Autor:
Edsel De Jesus, Ray Zhang, Shei Meng Loo, Geok Koon Orr, Jing-en Luan, Raquel Fundan, Loic Pierre Louis Renard
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
Copper wire and palladium coated copper wires used for interconnections, widely in mass production today. Many forecasts are showing an accelerating trend that the market is moving more into copper wire business due to cost. Though copper wire techno
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fbab9ca88a5ab068b6aef5e48c2a20ea
https://doi.org/10.1109/eptc.2017.8277527
https://doi.org/10.1109/eptc.2017.8277527
Autor:
Wingshenq Wong, Yiyi Ma, Kim-yong Goh, Tito Verano, Raquel Fundan, Xueren Zhang, Loic Pierre Louis Renard
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
As microelectronics is moving towards miniaturization, function integration and cost reduction, the device itself is becoming smaller while keeping same or even more functions. Silicon die with area less than 2×2 mm2 is common. This poses challenges
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ab9b7ac77c6583178aac6d951ef2675a
https://doi.org/10.1109/eptc.2014.7028402
https://doi.org/10.1109/eptc.2014.7028402