Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Raphael Eleouet"'
Autor:
Yosuke Oi, Laurent Pain, Mori Daisuke, Jerome Dechamp, Asahara Masahiro, Kan Katsushi, Maxime Argoud, Nacima Allouti, Raluca Tiron, Raphael Eleouet
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
We report recent advances in the processing of dry film Epoxy Molding Compounds (EMCs) through two technologies: lamination under vacuum and compression molding. From the perspective of 3D packaging, particularly for Fan-Out Wafer-Level Packaging (FO
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d13aeca25b1aa9644b13b32bfaa7612f
https://doi.org/10.1109/ectc32696.2021.00322
https://doi.org/10.1109/ectc32696.2021.00322
Autor:
Didier Campos, P. Coudrain, Yorrick Exbrayat, Lucile Arnaud, Stephane Minoret, F. Ponthenier, Andrea Vinci, Severine Cheramy, Alain Gueugnot, Daniel Scevola, Cesar Fuguet Tortolero, P. Chausse, Roselyne Segaud, Giovanni Romano, Christophe Aumont, Didier Lattard, Jean Charbonnier, Pierre-Emile Philip, C. Ribiere, Arnaud Garnier, Jean Michailos, Mathilde Gottardi, Raphael Eleouet, Frédéric Berger, Eric Guthmuller, Gilles Simon, Jerome Beltritti, Gilles Romero, Maxime Argoud, Denis Dutoit, Alexis Farcy, Nacima Allouti, Therry Mourier, Remi Velard, Pascal Vivet, Corinne Legalland
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
We report the first successful technology integration of chiplets on an active silicon interposer, fully processed, packaged and tested. Benefits of chiplet-based architectures are discussed. Built up technology is presented and focused on 3D interco
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d8afe955b96b263c988971d8f1f91372
https://doi.org/10.1109/ectc.2019.00092
https://doi.org/10.1109/ectc.2019.00092
Autor:
Sébastien Bérard-Bergery, Jean-Baptiste Henry, Alain Ostrovsky, Maryline Cordeau, Charlotte Beylier, Patrick Quéméré, Nacima Allouti, Raphael Eleouet, Florian Tomaso, Valérie Rousset, Jérôme Hazart
Publikováno v:
Design-Process-Technology Co-optimization for Manufacturability XIII.
There has been a significant increase of optical applications in the last decade, either embedded into complex multifunction devices such as smartphones, or for imaging purpose as cameras. Core of such optical systems are microlens arrays, used for l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fee87627a22946a904accc12c0f572ec
https://doi.org/10.1117/12.2514922
https://doi.org/10.1117/12.2514922
Autor:
Raphael Eleouet, L. Baud, F. Fournel, M. Pellat, L. Vignoud, P. Montméat, M. Zussy, L. Bally, T. Enot, Jerome Dechamp
Publikováno v:
Microsystem Technologies. 21:987-993
This paper deals with the improvement of the TTV values (Total Thickness Variation) of 300 mm silicon wafers thinned down at 100 μm using the ZoneBond ® (ZoneBond® is registred by Brewer Science Inc.) technology. We have demonstrated that the thin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c077e6ef95c21e3e580e6bb49f386fbb
https://doi.org/10.1007/s00542-015-2431-9
https://doi.org/10.1007/s00542-015-2431-9
Autor:
Christophe Aumont, Emmanuel Rolland, Laurent Bally, R. Hida, A. Jouve, M. Pellat, L. Gabette, Maxime Argoud, S. Cheramy, L. Vignoud, P. Montmeat, Raphael Eleouet, F. Fournel, C. Donche, K. Vial, C. Ratin, V. Loup, P. Coudrain, Thierry Mourier, C. Laviron, R. Kachtouli, Jerome Dechamp, N. Sillon, Nacima Allouti, Thomas Magis
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
Three-dimensional (3D) stacked IC technologies have become a central topic over the past few years, and start to become reality with the introduction of 3D devices in commercialization. Among the technical challenges raised by this technology, thin w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::221359d84e797e50085295156718b022
https://doi.org/10.1109/ectc.2013.6575557
https://doi.org/10.1109/ectc.2013.6575557