Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Ranjit Pandher"'
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:000706-000737
LED chip-on-board applications typically involve assembling an LED die stack directly on to a high thermal conductivity substrate such as a Metal Core PCB. If solder is used for die-substrate attach for such chip-on-board applications, one needs to c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5020d3773c1f384edaab1ea4a0587de7
https://doi.org/10.4071/2012dpc-ta43
https://doi.org/10.4071/2012dpc-ta43
Autor:
Morgana de Avila Ribas, Rahul Raut, Ranjit Pandher, Sujatha Chegudi, Siuli Sarkar, Sutapa Mukherjee, Anil Kumar, Bawa Singh
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
Low temperature alloys are used to achieve peak reflow temperatures from 170 to 200°C. Sn-Bi alloy stands as logic choices due to its low melting point, higher strength and low cost. However, use of Sn42-Bi58 alloy as soldering material is limited b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ec3ba2641f36f7aa6e2908a611552873
https://doi.org/10.1109/eptc.2014.7028385
https://doi.org/10.1109/eptc.2014.7028385
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Low-silver SnAgCu alloys are quickly becoming the standard Pb-free solders for portable electronic devices. However, the industry's quick adoption of near-eutectic SnAgCu alloys (SAC305 and SAC405, so called high-Ag Alloys) and its resistance to the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a0af66936fdefd896687c4f3ab61fc78
https://doi.org/10.1109/ectc.2011.5898587
https://doi.org/10.1109/ectc.2011.5898587
Publikováno v:
2010 12th Electronics Packaging Technology Conference.
Head-in-pillow (HIP) defect is a growing concern in the electronics industry. This defect is usually believed to be the result of several factors, individually or in combination. Some of the major contributing factors to the HIP defect are: surface q
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::863b4deccd24f45033fe6f1e8a14bdb8
https://doi.org/10.1109/eptc.2010.5702624
https://doi.org/10.1109/eptc.2010.5702624
Publikováno v:
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
In this paper, thermo-mechanical reliability of four different low-silver SnAgCu (SAC) lead free alloys is investigated in a harsh thermal environment of −55 to 125°C. Four configuration of test boards were assembled all having identical 100 I/O,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9007cbaf7abf13f7465a444d0a069d8
https://doi.org/10.1109/itherm.2010.5501303
https://doi.org/10.1109/itherm.2010.5501303
Autor:
Saurabh Athavale, Ranjit Pandher
Publikováno v:
2006 8th Electronics Packaging Technology Conference.
Even though lead is supposed to disappear from most of the electronic components in the near future, there is still an industry wide intense effort to find new lead-free alloys, or variations within the existing general class of widely accepted lead-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::12c6785a697586e2285775521a89bf1c
https://doi.org/10.1109/eptc.2006.342800
https://doi.org/10.1109/eptc.2006.342800