Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Ranjit Kashid"'
Autor:
Xiqiao Wang, Ehsan Khatami, Fan Fei, Jonathan Wyrick, Pradeep Namboodiri, Ranjit Kashid, Albert F. Rigosi, Garnett Bryant, Richard Silver
Publikováno v:
Nature Communications, Vol 13, Iss 1, Pp 1-12 (2022)
Atomically precise artificial lattices of dopant-based quantum dots offer a tunable platform for simulations of interacting fermionic models. By leveraging advances in fabrication and atomic-state control, Wang et al. report quantum simulations of th
Externí odkaz:
https://doaj.org/article/b1c2a41d4c9c4435bc1e4b3deb2038b6
Autor:
Ranjit Kashid, Jayanta Kumar Mishra, Avradip Pradhan, Tanweer Ahmed, Saloni Kakkar, Pranav Mundada, Preeti Deshpande, Kallol Roy, Ambarish Ghosh, Arindam Ghosh
Publikováno v:
APL Materials, Vol 8, Iss 9, Pp 091114-091114-7 (2020)
The transfer of charge carriers across the optically excited hetero-interface of graphene and semiconducting transition metal dichalcogenides (TMDCs) is the key to convert light to electricity, although the intermediate steps from the creation of exc
Externí odkaz:
https://doaj.org/article/b5603f0d3c0f44f8a4a4d6ae53d29e48
Autor:
Jesly Joseph, Jyoti Kondhalkar, Pankaj Jagdale, Janardhan Rao Gadde, Ranjit Hawaldar, Ranjit Kashid, Vijaya Giramkar, Shany Joseph
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 1248:012095
DLP (Digital Light Processing) based 3D (three dimensional) printing had been a widely used additive manufacturing technique with its broad aspects in rapid prototyping, packaging, biomedical applications, PCB etc due to its high resolution and relia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::98ba86cbe1c446c9dedb084e05e90500
https://doi.org/10.1088/1757-899x/1248/1/012095
https://doi.org/10.1088/1757-899x/1248/1/012095
Autor:
K P Aishwarya, Rohan Darve, Janardhan Rao Gadde, Hrithik Kale, Ranjit Hawaldar, Vijaya Giramkar, Ranjit Kashid, Shany Joseph
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 1248:012096
In the era of miniaturization and hybridization, the quest for novel materials for multilayer packaging had been increased. The multilayer packaging includes High Temperature Co-Fired Ceramics (HTCC), LTCC and ULTCC. LTCC which is the mixture of cera
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c24b3387b6e57fcf2298b741422a5b3c
https://doi.org/10.1088/1757-899x/1248/1/012096
https://doi.org/10.1088/1757-899x/1248/1/012096