Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Ranee Wai-Ling Kwong"'
Autor:
Ranee Wai-Ling Kwong, Sen Liu, W. Li. Khojasteh, P. R. Varanasi, Rex Chen, Irene Popova, Margaret C. Lawson
Publikováno v:
Journal of Photopolymer Science and Technology. 20:481-491
The combination of immersion lithography and reticle enhancement techniques (RETs) has extended 193nm lithography into the 45nm node and possibly beyond. In order to fulfill the tight pitch and small critical dimension requirements of these future te
Autor:
Mahmoud Khojasteh, Margaret C. Lawson, Gary Dabbagh, Linda K. Sundberg, Y. Nishiyama, Kuang-Jung J. Chen, Tsutomu Shimokawa, M. Siezak, Takashi Chiba, P. J. Brock, Ranee Wai-Ling Kwong, R. Sooriyakumaran, Wai-kin Li, P. R. Varanasi, Robert D. Allen, Kaushal Patel, Z. Liu
Publikováno v:
Journal of Photopolymer Science and Technology. 18:381-387
We have designed and developed a variety of hexafluoroalcohol (HFA) pendant methacrylate monomers and the corresponding imaging polymers for ArF lithography. It was found that HFA side chains are critical for "swelling free" dissolution properties fo
Autor:
Wu-Song Huang, Karen Petrillo, Arpan P. Mahorowala, Ranee Wai-Ling Kwong, Marie Angelopoulos, Wayne M. Moreau, C. R. Guarnieri, Arieh Aviram, David R. Medeiros, Christopher Magg
Publikováno v:
IBM Journal of Research and Development. 45:639-650
Resists for advanced mask-making with high-voltage electron-beam writing tools have undergone dramatic changes over the last three decades. From PMMA and the other early chain-scission resists for micron dimensions to the aqueous-base-developable, dr
Autor:
Krishna Gandi Sachdev, Harbans S. Sachdev, Ahmad D. Katnani, Ranee Wai-Ling Kwong, Wu-Song Huang
Publikováno v:
Microelectronic Engineering. 27:393-396
A new acid amplified negative tone resist system is described which utilizes the formation of tetrahydropyranyl ether group for the crosslinking reaction. In a three component system, the phenolic groups of the matrix resin add to the dihydropyranyl
Autor:
Ranee Wai-Ling Kwong, Wayne M. Moreau, Warren Montgomery, William R. Brunsvold, Kevin M. Welsh, Harbans S. Sachdev, R. Kvitek, Willard E. Conley
Publikováno v:
Microelectronic Engineering. 13:19-22