Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Randall M. Stoltenberg"'
Autor:
Alfred A. Zinn, Mina Izadjoo, Hosan Kim, Rachel L. Brody, Robert R. Roth, Agustin Vega, Khanh K. Nguyen, Nhi T. Ngo, Hannah T. Zinn, Nicholas Antonopoulos, Randall M. Stoltenberg
Publikováno v:
Frontiers in Cellular and Infection Microbiology, Vol 11 (2021)
The continued proliferation of superbugs in hospitals and the coronavirus disease 2019 (COVID-19) has created an acute worldwide demand for sustained broadband pathogen suppression in households, hospitals, and public spaces. In response, we have cre
Externí odkaz:
https://doaj.org/article/1d7a859547b44b40925460486ceb0bfa
Publikováno v:
2021 IEEE 16th Nanotechnology Materials and Devices Conference (NMDC).
Publikováno v:
2021 IEEE 16th Nanotechnology Materials and Devices Conference (NMDC).
Publikováno v:
2021 IEEE 21st International Conference on Nanotechnology (NANO).
We set out to affirm the high reliability of a novel nanocopper-based highly conductive bond agent that allows the formulation of an entire suite of Tunable Engineered Copper (TEC) pastes and inks suited for a wide range of SMT die-bonding and packag
Autor:
Li Zhenggang, Reynaldo Joven, Alex Capanzana, Agustin Vega, Nhi Ngo, Yeng Ming Lam, Randall M. Stoltenberg, Alfred A. Zinn, Chee Lip Gan
Publikováno v:
2021 IEEE 21st International Conference on Nanotechnology (NANO).
Current and next-generation high power devices require a new set of materials with higher electrical and thermal conductivity to efficiently spread and remove increased waste heat. Kuprion's ActiveCopper technology enables the formation of bulk coppe
Autor:
Tae Hoon Lee, Benjamin C. K. Tee, Do Hwan Kim, Randall M. Stoltenberg, Gi Xue, Gaurav Giri, Ying Diao, Stefan C. B. Mannsfeld, Hector A. Becerril, Jie Xu, Zhenan Bao
Publikováno v:
Nature Materials. 12:665-671
Solution coating of organic semiconductors offers great potential for achieving low-cost manufacturing of large-area and flexible electronics. However, the rapid coating speed needed for industrial-scale production poses challenges to the control of
Autor:
Alfred A. Zinn, Randall M. Stoltenberg, Shannon M. Clark, Jerome Chang, Yuan-Ling Tseng, David A. Cullen
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
A novel nanocopper-based packaging material was developed for robust, void-free thermal interfaces between LEDs and heat sinks/spreaders. It is applicable to other high power components and devices allowing sub-10 micron thermal interfaces to enable
Publikováno v:
2016 IEEE 16th International Conference on Nanotechnology (IEEE-NANO).
A nanocopper-based interconnect material was developed as a robust, high-performance alternative to solder. This new solder-free nanocopper material overcomes an inherent limitation of traditional solders wherein the operating temperature is limited
Autor:
Xuefeng Guo, Mallory L. Hammock, Yinchao Bril Wang, Randall M. Stoltenberg, Irfan Irfan, Zhenan Bao, Michael Vosgueritchian, Chuancheng Jia, Sondra L. Hellstrom, Yongli Gao
Publikováno v:
Nano Letters. 12:3574-3580
MoO(x) has been used for organic semiconductor doping, but it had been considered an inefficient and/or unstable dopant. We report that MoO(x) can strongly and stably dope carbon nanotubes and graphene. Thermally annealed MoO(x)-CNT composites can fo
Autor:
Benjamin D. Naab, Mallory L. Hammock, Randall M. Stoltenberg, Zhenan Bao, Anatoliy N. Sokolov
Publikováno v:
ACS Nano. 6:3100-3108
The use of organic transistors as sensing platforms provides a number of distinct advantages over conventional detection technologies, including their tunability, portability, and ability to directly transduce binding events without tedious and expen