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Autor:
Sana J. Yaseen, Zainab K. Radhi, Rana L. Natoosh, Raheem Al-Sabur, Raad Z. Homod, Hayder I. Mohammed
Publikováno v:
International Journal of Thermofluids, Vol 23, Iss , Pp 100759- (2024)
The efficient thermal management of microelectronic devices is crucial for their reliability and performance. Heat sinks, particularly those with inline and staggered fin arrangements, are vital in achieving this goal. This study leverages the advanc
Externí odkaz:
https://doaj.org/article/8ff55b6fdef34306993fcc780113b4f4
