Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Ramji Dhakal"'
Autor:
Laura S Hackl, Lidan Du-Skabrin, Amry Ok, Chiza Kumwenda, Navy Sin, Lukonde Mwelwa-Zgambo, Ramji Dhakal, Bubala Thandie Hamaimbo, Elise C Reynolds, Katherine P Adams, Charles D Arnold, Christine P Stewart, Erin M Milner, Sarah Pedersen, Jennifer Yourkavitch
Publikováno v:
Public Health Nutrition, Vol 27 (2024)
Abstract Objective: To compare the agreement and cost of two recall methods for estimating children’s minimum dietary diversity (MDD). Design: We assessed child’s dietary intake on two consecutive days: an observation on day one, followed by t
Externí odkaz:
https://doaj.org/article/03e19f5b857c48d29ab8bde4bbdc0dfa
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Compressed schedules for new technologies often require development of novel strategies for reliability qualification. Highly accelerated test conditions are frequently implemented to meet condensed product schedules. Failures in such aggressive test
Publikováno v:
Journal of Electronic Materials. 37:1139-1147
A combination of various experimental techniques was coupled with three-dimensional numerical simulation to study the strain distribution in anisotropic, heterogeneous lead (Pb)-free solder ball grid array interconnects used in electronic packages. A
Publikováno v:
Acta Materialia. 55:3253-3260
Optical microscopy was used to discern the different grain orientations and grain boundaries on the polished cross-sections of near-eutectic lead-free board-level SnAgCu (SAC) solder interconnects. Strain distributions with submicron accuracy of the
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 30:178-185
Digital image correlation and cross polarizer, optical microscopy were used to quantify the deformation behavior under deep thermal cycling of near eutectic SnAgCu (SAC) solder in board level interconnects. Maps with sub micron spatial resolution of
Autor:
Ramji Dhakal, Nick Emmel, Megha Raj Dhakal, Padam Chand, Druba Thapa, Charles Collins, Damodar Adhikari, Mayeh Omar, Arjun B. Singh
Publikováno v:
Journal of health organization and management. 21(6)
PurposeThe purpose of this paper is to describe and discuss policy analysis in Nepal and review the wide range of choices feasible in decentralisation decision making.Design/methodology/approachIn this paper an iterative qualitative method was develo
Publikováno v:
Advances in Electronic Packaging, Parts A, B, and C.
The thermo-mechanical behavior of near eutectic lead-free SnAgCu (SAC) solder joints under Deep Thermal Cycling (DTC) and in-situ thermal loading was examined. Crossed polarizer, optical microscopy revealed that in ball grid array (BGA) solder joints