Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Ramgopal Uppalapati"'
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
As customers embrace new mobile market segments, electronic systems containing direct ball grid array (BGA) components will inevitably experience greater stresses resting from shock and drop events during their use. These events can result in BGA fie
Publikováno v:
2007 Proceedings 57th Electronic Components and Technology Conference.
With the technology trend moving towards faster, smaller, and cheaper products, the consumer electronics industry is using more and more high density fine pitch BGA components in a lead-free environment. This has created additional board-level solder
Publikováno v:
56th Electronic Components and Technology Conference 2006.
Heat sink (HS) as thermo-mechanical solution is widely used in modern electronic packaging system including mobile, desktop and server machines to improve and maintain system thermal performance by removing heat away from IC component such as flip ch
Publikováno v:
Parts Selection and Management
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::684507d054c69f8b9e31c789d59bd3ee
https://doi.org/10.1002/0471723886.ch6
https://doi.org/10.1002/0471723886.ch6