Zobrazeno 1 - 10
of 27
pro vyhledávání: '"Ramez Cheaito"'
Autor:
Douglas L. Medlin, Ramez Cheaito, Jon F. Ihlefeld, Patrick E. Hopkins, John T. Gaskins, Takanori Mimura, Harlan James Brown-Shaklee, Ashutosh Giri
Publikováno v:
ACS applied materialsinterfaces. 13(10)
We experimentally show that the thermal conductance across confined solid-solution crystalline thin films between parent materials does not necessarily lead to an increase in thermal resistances across the thin-film geometries with increasing film th
Autor:
Patrick E. Hopkins, Yang Shen, John T. Gaskins, Ramez Cheaito, Brian M. Foley, Xiaojun Xie, Joe C. Campbell
Publikováno v:
Journal of Lightwave Technology. 35:4242-4246
The performance of high-power photodiodes flip-chip bonded on polycrystalline aluminum nitride (AlN), single-crystal AlN, and diamond submounts are compared. The thermal boundary conductance (inverse of the thermal boundary resistance) between submou
Autor:
Aditya Sood, Yi Cui, Davide Donadio, Feifei Lian, Kenneth E. Goodson, Ramez Cheaito, Mehdi Asheghi, Feng Xiong, Shunda Chen, Eric Pop
Publikováno v:
Nano letters, vol 19, iss 4
Layered two-dimensional (2D) materials have highly anisotropic thermal properties between the in-plane and cross-plane directions. In general, it is thought that cross-plane thermal conductivities ($\kappa_z$) are low, and therefore c-axis phonon mea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ae128646c4fec37ad88b7b5dd968e41a
https://escholarship.org/uc/item/5n73g6zr
https://escholarship.org/uc/item/5n73g6zr
Autor:
Aditya, Sood, Feng, Xiong, Shunda, Chen, Ramez, Cheaito, Feifei, Lian, Mehdi, Asheghi, Yi, Cui, Davide, Donadio, Kenneth E, Goodson, Eric, Pop
Publikováno v:
Nano letters. 19(4)
Layered two-dimensional (2D) materials have highly anisotropic thermal properties between the in-plane and cross-plane directions. Conventionally, it is thought that cross-plane thermal conductivities (κ
Autor:
Jeffrey L. Braun, Jon Paul Maria, Ramez Cheaito, Elizabeth A. Paisley, Jon F. Ihlefeld, Christopher T. Shelton, Kelsey Meyer, Patrick E. Hopkins
Publikováno v:
Journal of Materials Science. 51:10408-10417
Phonon scattering in crystalline systems can be strongly dictated by a wide array of defects, many of which can be difficult to observe via standard microscopy techniques. We experimentally demonstrate that the phonon thermal conductivity of MgO thin
Autor:
Tingyu Bai, Ramez Cheaito, Samuel Graham, Kenneth E. Goodson, Mehdi Asheghi, Thomas L. Bougher, Mark S. Goorsky, Yekan Wang, Heungdong Kwon, Luke Yates, Chao Li, Aditya Sood
Publikováno v:
Nano letters. 18(6)
Understanding the impact of lattice imperfections on nanoscale thermal transport is crucial for diverse applications ranging from thermal management to energy conversion. Grain boundaries (GBs) are ubiquitous defects in polycrystalline materials, whi
Autor:
Sadhvikas Addamane, Ramez Cheaito, Avik W. Ghosh, Ganesh Balakrishnan, Jingjie Zhang, Patrick E. Hopkins, Carlos A. Polanco
Publikováno v:
Physical Review B. 97
We report on the room temperature thermal conductivity of AlAs-GaAs superlattices (SLs), in which we systematically vary the period thickness and total thickness between $2--24\phantom{\rule{0.16em}{0ex}}\mathrm{nm}$ and $20.1--2,160\phantom{\rule{0.
Publikováno v:
Journal of Materials Research. 30:1403-1412
The progressive build up of fission products inside different nuclear reactor components can lead to significant damage of the constituent materials. We demonstrate the use of time-domain thermoreflectance (TDTR), a nondestructive thermal measurement
Autor:
Luke Yates, Aditya Sood, Thomas L. Bougher, Firooz Faili, Kenneth E. Goodson, Ramez Cheaito, Zhe Cheng, Mehdi Asheghi, Brian M. Foley, Baratunde A. Cola, Samuel Graham, Mark S. Goorsky, Tingyu Bai
Publikováno v:
International Heat Transfer Conference 16.
Autor:
Brian M. Foley, Joe C. Campbell, Xiaojun Xie, Ramez Cheaito, John T. Gaskins, Patrick E. Hopkins, Yang Shen
Publikováno v:
2017 IEEE Photonics Conference (IPC).
The performance of high power photodiodes flip-chip bonded on multi-crystal aluminum nitride (AlN), single-crystal AlN, and diamond submounts are compared. The thermal boundary conductance of submount-Ti interfaces was measured and found to be the pr