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pro vyhledávání: '"Rameish Rao Subarmaniyan"'
Publikováno v:
2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference.
Most of the device's technology has been moving towards the complex and produce of Nano-IC with demands for cheaper cost, smaller size and better thermal and electrical performance. One of the marketable packages is Quad Flat No-Lead (QFN) package. D
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97a6972172c6abf51c606ab5d80d3e5b
https://doi.org/10.1109/iemt.2016.7761936
https://doi.org/10.1109/iemt.2016.7761936
