Výsledky vyhledávání - "Rameish Rao Subarmaniyan"

QFN challenges: Second bond improvement to eliminate the weak stitch (fish tail) failure mechanism on pre plated lead frame

Autor: Camella Chee Guey Yong, Rameish Rao Subarmaniyan, Jacky Lee Sinn Fah, Sreetharan Sekaran

Publikováno v: 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference.

Most of the device's technology has been moving towards the complex and produce of Nano-IC with demands for cheaper cost, smaller size and better thermal and electrical performance. One of the marketable packages is Quad Flat No-Lead (QFN) package. D

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::97a6972172c6abf51c606ab5d80d3e5b
https://doi.org/10.1109/iemt.2016.7761936

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Conference

QFN challenges: Second bond improvement to eliminate the weak stitch (fish tail) failure mechanism on pre plated lead frame.

Autor: Fah, Jacky Lee Sinn, Sekaran, Sreetharan, Subarmaniyan, Rameish Rao, Yong, Camella Chee Guey

Publikováno v: 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials & Packaging (EMAP) Conference; 2016, p1-6, 6p

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