Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Rama Puligadda"'
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2019:000908-000931
Multifunctional materials are a relatively new topic in the semiconductor industry for wafer-level packaging (WLP). With the increase in processing steps and the emergence of more advanced technologies, the use of multifunctional materials will becom
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aef33e85d96af002a558545be5aff83b
https://doi.org/10.4071/2380-4491-2019-dpc-presentation_wp1_046
https://doi.org/10.4071/2380-4491-2019-dpc-presentation_wp1_046
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Better performance and lower cost are always key trends being pursued in the semiconductor industry. Moore's law has provided a very well-defined relationship between performance and cost and the semiconductor industry has followed this law for the p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a0c67d050ba317613f9187cf27c0ebea
https://doi.org/10.1109/ectc32696.2021.00123
https://doi.org/10.1109/ectc32696.2021.00123
Publikováno v:
2021 China Semiconductor Technology International Conference (CSTIC).
Temporary bonding (TB) and debonding (DB) of wafers have been widely developed and applied over the last decade in various wafer-level packaging technologies, such as package-on-package (PoP), fan-out integration, and 2.5D and 3D integration using th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a6b9df075f89a54d80e0e3313b202c6b
https://doi.org/10.1109/cstic52283.2021.9461508
https://doi.org/10.1109/cstic52283.2021.9461508
Publikováno v:
2020 China Semiconductor Technology International Conference (CSTIC).
Performance and cost are the two main driving forces for high demand of new advanced packaging technologies. It's not only OSATs and packaging houses that investigate advanced packaging systems anymore. Foundries and IDMs now also recognize that perf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d73d7f8501a26477d8a2857dd0894ea7
https://doi.org/10.1109/cstic49141.2020.9282526
https://doi.org/10.1109/cstic49141.2020.9282526
Autor:
Deborah Blumenshine, Markus Arendt, Habib Hichri, Tony D. Flaim, Cristina R. Matos-Pérez, Lisa M. Kirchner, Rama Puligadda, Seongkuk Lee
Publikováno v:
International Symposium on Microelectronics. 2017:000300-000303
As the semiconductor technology and the field evolves, the need for new applications can facilitate the development of new materials and processes. Device size is continuously shrinking, and materials that have low stress can promote new developments
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::34c40518b6db2812b744cc12eed2f4f7
https://doi.org/10.4071/isom-2017-wa52_053
https://doi.org/10.4071/isom-2017-wa52_053
Autor:
Baron Huang, Rama Puligadda, Xiao Liu, Lisa M. Kirchner, Tony D. Flaim, Hong Zhang, Southard Arthur O
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
The development of new advanced packaging technologies is always in high demand due to the continuous pursuit of smaller package sizes, higher performance, more integration of functionalities, lower power consumption, and reduced cost of ownership. A
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6fae6d2538ca427c88176d002ee8f398
https://doi.org/10.1109/ectc.2019.00264
https://doi.org/10.1109/ectc.2019.00264
Publikováno v:
2019 China Semiconductor Technology International Conference (CSTIC).
There is always an increasing demand for new materials with unique properties as technical enablers to facilitate different semiconducting advanced packaging platforms. This long-lasting demand is more urgent than ever due to the era of a slowing Moo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8afdea206a9b6f7516d2befb98a750e1
https://doi.org/10.1109/cstic.2019.8755757
https://doi.org/10.1109/cstic.2019.8755757
Publikováno v:
2018 International Wafer Level Packaging Conference (IWLPC).
Laser release materials have become an important topic in the semiconductor industry for wafer-level packaging (WLP) due to its many advantages over other temporary bond and debond (TB/DB) methods, including mechanical and thermal slide. These method
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::55aa71dd04101eaf83942e7ba9131052
https://doi.org/10.23919/iwlpc.2018.8573259
https://doi.org/10.23919/iwlpc.2018.8573259
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Recently, fan-out wafer-level packaging (FOWLP) has become a mainstream technology to meet increased demand for larger scale high-density packages. FOWLP provides multi-chip functionality, with a smaller footprint and thinner package, resulting in hi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5a5131fdadea32243fe3284f9bc016d
https://doi.org/10.1109/ectc.2018.00289
https://doi.org/10.1109/ectc.2018.00289
Autor:
Qi Wu, Dongshun Bai, Ramachandran Trichur, Hong Zhang, Xiao Liu, Tony D. Flaim, Rama Puligadda
Publikováno v:
2018 China Semiconductor Technology International Conference (CSTIC).
Laser release technology provides advantages including high throughput and low stress during the release process, effective thin-substrate handling, and ease of application, even with large panels. It has drawn a large amount of attention and has bec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9908261dfd0b7ab55ff0c13a3dbed8d4
https://doi.org/10.1109/cstic.2018.8369304
https://doi.org/10.1109/cstic.2018.8369304