Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Ralph Lauwaert"'
Autor:
Bart Vandevelde, Riet Labie, Ralph Lauwaert, Rainer Dudek, Przemyslaw Gromala, Michael Eichorst
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb036dc1720277aed4d5d75030e9f27b
https://doi.org/10.1109/eurosime56861.2023.10100841
https://doi.org/10.1109/eurosime56861.2023.10100841
Publikováno v:
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
SnBi based solder alloys become an interesting alternative for standard SnAgCu as they can be used to solder components at much lower temperature. The typically 50°C lower solder reflow temperature is less damaging for PCB and components, and also p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2fac97b226e7de4521cf91806562b89a
https://doi.org/10.1115/ipack2021-73456
https://doi.org/10.1115/ipack2021-73456
Autor:
Bart Allaert, Riet Labie, Johan De Baets, Lieven Degrendele, Filip Vanhee, Franco Zanon, Bart Vandevelde, Ralph Lauwaert, Geert Willems, Davy Pissoort
Publikováno v:
Microelectronics Reliability. 74:131-135
This paper deals with an alternative testing approach for quantifying the life time of board level solder joint reliability of components. This approach consists of applying a relative shear displacement between component and Printed Circuit Board (P
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9caa99dda3b89f37183922e5af839a8b
https://doi.org/10.1016/j.microrel.2017.04.008
https://doi.org/10.1016/j.microrel.2017.04.008
Autor:
Eddy Blansaer, Riet Labie, Ralph Lauwaert, Daniel Werkhoven, Davy Pissoort, Daniel Vanderstraeten, Jonas Lannoo, Bart Vandevelde
Publikováno v:
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
In this work, the solder joint reliability of QFN components is experimentally tested in thermal cycling and four-point bending cycling conditions, and this for three different solder materials: standard SAC305, low Ag SAC alloy and a new low melting
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d9f25cb914bf1d18c0b37f308b38235
https://doi.org/10.1109/eurosime.2019.8724511
https://doi.org/10.1109/eurosime.2019.8724511
Autor:
Riet Labie, Davy Pissoort, Jan Mehner, Ralph Lauwaert, Filip Vanhee, Chinmay Nawghane, Bart Allaert, Bart Vandevelde, Ingrid De Wolf
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
This paper is aimed at researching the impact of vibrations on chip scale packages (CSPs) assembled on a printed circuit board (PCB) and exploring finite element technique to investigate PCB assembly under vibration load. Importance of experimental m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4cd779f7d07692f21dfdcc3375f2e0e3
https://doi.org/10.1109/eurosime.2018.8369950
https://doi.org/10.1109/eurosime.2018.8369950
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
A modified Charpy impact testing tool is used for the characterization of brittle fractures at the solder — board finish transition. The application of an accelerometer on the hammer allows to extract additional impact parameters which characterize
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a50e9cdf748197d18a5df946b9a61cd
https://doi.org/10.1109/eurosime.2018.8369920
https://doi.org/10.1109/eurosime.2018.8369920
Autor:
Bart Vandevelde, Johan De Baets, Bart Allaert, Filip Vanhee, Geert Willems, Davy Pissoort, Ralph Lauwaert, Riet Labie, Lieven Degrendele
This paper deals with an alternative testing approach for quantifying the life time of board level solder joint reliability of components. This approach consists of applying a relative shear displacement between component and Printed Circuit Board (P
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::62d8152507a0b79bc919fbcf066b25c9
https://lirias.kuleuven.be/handle/123456789/603652
https://lirias.kuleuven.be/handle/123456789/603652
