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pro vyhledávání: '"Rajesh V. Saranam"'
Autor:
Rajesh V. Saranam, Monica Kapoor, Ömer N. Doğan, Patrick S. McNeff, Brian K. Paul, Casey Carney
Publikováno v:
Metallurgical and Materials Transactions A. 48:3343-3356
Transient-liquid-phase bonding using Ni-P as an interlayer has been developed for H230 Ni-Cr-W solid-solution-strengthened Ni-based alloy. Two process parameters—composition of the interlayer and bonding time—have been varied to optimize the mech
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ebbc38b0dfacd50bd79240e94726586a
https://doi.org/10.1007/s11661-017-4127-5
https://doi.org/10.1007/s11661-017-4127-5
