Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Rajen S. Sidhu"'
Publikováno v:
Engineering Fracture Mechanics. 131:9-25
Solder joints in electronic packages undergo thermo-mechanical cycling, resulting in nucleation of micro-cracks, especially at the solder/bond-pad interface, which may lead to fracture of the joints. The fracture toughness of a solder joint depends o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3b9970981b94319d14bf7159ab77ed83
https://doi.org/10.1016/j.engfracmech.2014.10.003
https://doi.org/10.1016/j.engfracmech.2014.10.003
Publikováno v:
Journal of Electronic Materials. 43:4485-4496
When dropped, electronic packages often undergo failure by propagation of an interfacial crack in solder joints under a combination of tensile and shear loading. Hence, it is crucial to understand and predict the fracture behavior of solder joints un
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::695db3cb5dee6fa7ea5e7d70bf109693
https://doi.org/10.1007/s11664-014-3441-6
https://doi.org/10.1007/s11664-014-3441-6
Autor:
Ravi Mahajan, Indranath Dutta, Uttara Sahaym, M. Renavikar, Jia Liu, Rishi Raj, Rajen S. Sidhu
Publikováno v:
Journal of Materials Science. 49:7844-7854
Cu particle-containing In-matrix composites for thermal interface material (TIM) applications were prepared via liquid phase sintering, following chemical modification of the Cu–In interfaces. The optimized composite TIM possessed 1.5 times the the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::be8d86b03be4c4329afa08283aee11f4
https://doi.org/10.1007/s10853-014-8495-6
https://doi.org/10.1007/s10853-014-8495-6
Publikováno v:
Journal of Electronic Materials. 41:412-424
A methodology to construct fracture mechanism maps for Sn-3.8%Ag-0.7%Cu (SAC387) solder joints attached to Cu substrates has been developed. The map, which delineates the operative mechanisms of fracture along with corresponding joint fracture toughn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fa6b39befc3af7f8d105e3997f450209
https://doi.org/10.1007/s11664-011-1806-7
https://doi.org/10.1007/s11664-011-1806-7
Publikováno v:
Journal of Materials Science. 46:7012-7025
This study reports on the processing and characterization of composite solders produced by liquid phase sintering, which comprise a high-melting phase such as Cu embedded in a matrix of a low-melting phase such as In. These solders combine higher ele
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f4ae252c0a0adf6761c1542ed8532be
https://doi.org/10.1007/s10853-011-5670-x
https://doi.org/10.1007/s10853-011-5670-x
Publikováno v:
JOM. 63:47-51
The conversion to lead-free solder alloys and increasing dynamic warpage due to the coefficient of thermal expansion (CTE) mismatch and thinner microelectronic packaging technology has resulted in a significant increase in the risk of solder joint de
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba4ca102e0021e4e1feda1d6dc333d0f
https://doi.org/10.1007/s11837-011-0174-3
https://doi.org/10.1007/s11837-011-0174-3
Autor:
Nikhilesh Chawla, Rajen S. Sidhu
Publikováno v:
Metallurgical and Materials Transactions A. 39:799-810
The thermal fatigue resistance of Sn-rich solder joints is dependent on the initial microstructure and damage evolution during thermal cycling. In this study, we have investigated the thermal fatigue behavior of single-lap-shear Sn-rich solder/Cu joi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d1ed6c5087093c634166945f2f70455e
https://doi.org/10.1007/s11661-008-9480-y
https://doi.org/10.1007/s11661-008-9480-y
Autor:
Rajen S. Sidhu, Nikhilesh Chawla
Publikováno v:
Metallurgical and Materials Transactions A. 39:340-348
Solders are used as interconnect materials in microelectronic packaging. Traditionally, eutectic and near-eutectic Pb-Sn solder alloys have been used. Due to the toxic nature of lead, environmentally-benign Sn-rich (Pb-free) solders are being develop
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43db7a1e6442f4a352fe7fd19a576437
https://doi.org/10.1007/s11661-007-9414-0
https://doi.org/10.1007/s11661-007-9414-0
Publikováno v:
Metallurgical and Materials Transactions A. 39:349-362
Microstructure plays a critical role in the mechanical behavior of Sn-rich solder alloys. A unified mechanistic understanding of creep in Sn-rich solder alloys, at various microstructural length scales, is missing. Part I of this study focused on mic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::acfc2060460f628d7a7330787f13c0b7
https://doi.org/10.1007/s11661-007-9412-2
https://doi.org/10.1007/s11661-007-9412-2
Publikováno v:
Journal of Electronic Materials. 36:1615-1620
We report on the nature of the orientation of Ag3Sn and the Ag3Sn/Sn interface in Sn-3.5Ag solder. Orientation imaging microscopy (OIM) and transmission electron microscopy (TEM) were used to characterize the orientation and nature of the interface,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92f3d3fd0daa07d3c113de2f697ecd3d
https://doi.org/10.1007/s11664-007-0239-9
https://doi.org/10.1007/s11664-007-0239-9