Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Rajen Murugan"'
Publikováno v:
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5d9ecfa7836666f1ff6e05e76de898ca
https://doi.org/10.1109/edaps56906.2022.9995226
https://doi.org/10.1109/edaps56906.2022.9995226
Autor:
Jie Chen, Rajen Murugan, Sooping Saw, Francisco Lauzurique, John Broze, Craig Greenberg, Alex Triano, Bibhu Nayak, Harikiran Muniganti, Joe Sivaswamy, Dipanjan Gope
Publikováno v:
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d851d251b349b87521d15401dab079f0
https://doi.org/10.1109/epeps53828.2022.9947145
https://doi.org/10.1109/epeps53828.2022.9947145
Autor:
Aditya N. Jogalekar, Oscar F. Medina, Andrew Blanchard, Rashaunda Henderson, Mahadevan K. Iyer, Hassan Ali, Rajen Murugan, Tony Tang
Publikováno v:
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43c579f098842ff18d93fef2e5c4ea2d
https://doi.org/10.1109/epeps53828.2022.9947116
https://doi.org/10.1109/epeps53828.2022.9947116
Publikováno v:
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::890429602a2f8a008808120796a141db
https://doi.org/10.1109/epeps53828.2022.9947128
https://doi.org/10.1109/epeps53828.2022.9947128
Autor:
Aditya N. Jogalekar, Oscar F. Medina, Andrew Blanchard, Rashaunda Henderson, Mahadevan K. Iyer, Tony Tang, Rajen Murugan, Hassan Ali
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::65ad1e3211d6a52c66e17661dfbd0db7
https://doi.org/10.1109/ectc51906.2022.00068
https://doi.org/10.1109/ectc51906.2022.00068
Publikováno v:
International Symposium on Microelectronics. 2020:000015-000020
Generally, IC packages with exposed pads have excellent thermal and electrical performance – assuming high fidelity and integrity of die attach material. However, reliability challenges associated with die attach impacts electrical performance of v
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9593bfb37bc1e7d31324521d6a9c1061
https://doi.org/10.4071/2380-4505-2020.1.000015
https://doi.org/10.4071/2380-4505-2020.1.000015
Autor:
Aditya N. Jogalekar, Oscar F. Medina, Andrew Blanchard, Rashaunda Henderson, Mahadevan K. Iyer, Tony Tang, Rajen Murugan, Hassan Ali
Publikováno v:
2021 IEEE MTT-S International Microwave and RF Conference (IMARC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dce6938474623b69e9e8dbec23d8ea4d
https://doi.org/10.1109/imarc49196.2021.9714582
https://doi.org/10.1109/imarc49196.2021.9714582
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
The drive for highly integrated ultrasonic scanners electronics stems from the ever-increasing demand for portable, high-quality miniaturize ultrasound imaging systems. Integration drives design complexities due to increase electromagnetic interactio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5e3b5203ec3c06546c74dcd97b5b0955
https://doi.org/10.1109/ectc32862.2020.00220
https://doi.org/10.1109/ectc32862.2020.00220
Publikováno v:
International Symposium on Microelectronics. 2018:000180-000185
In this paper we detail the system (viz. silicon-package-pcb) electrical co-design of a 130nm BiCMOS high-speed (25Gbps) 4-channel multi-rate retimer, packaged in a small 6-mm × 6-mm FC BGA package, with integrated advanced signal conditioning circu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c6ed62d5237f77e12217dae1b880bd87
https://doi.org/10.4071/2380-4505-2018.1.000180
https://doi.org/10.4071/2380-4505-2018.1.000180
Autor:
Steven Kummerl, Edwin Lim, Usman M. Chaudhry, Jack Grantham, Rajen Murugan, Tatsuhiro Shimizu, Jie Chen, Thatcher Klumpp
Publikováno v:
International Symposium on Microelectronics. 2018:000193-000197
In this paper, we detailed the system (die + package + pcb) electrothermal co-design modeling and silicon validation effort that led to the industry's first, highly accurate, voltage-output current-sense amplifier. By integrating and co-designing the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b5992ec32f3a14a500b34548252f51e5
https://doi.org/10.4071/2380-4505-2018.1.000193
https://doi.org/10.4071/2380-4505-2018.1.000193