Zobrazeno 1 - 10
of 27
pro vyhledávání: '"Rajdip Mukherjee"'
Publikováno v:
Philosophical Magazine Letters. 101:160-172
In the present work, we adopt a computational approach to study the evolution of microstructure during solidification of a Ti-Fe-Co-Ni-Cu multi-component alloy system by regarding it as a Ti-(Cu, N...
Publikováno v:
Materials Letters. 324:132630
Publikováno v:
Journal of Physics and Chemistry of Solids. 132:236-243
We develop a phase-field model, integrating both micromagnetic and microelastic approaches. The model can capture the impact of eigen strain, applied stress and elastic inhomogeneity on the microstructure evolution in presence of an externally applie
Publikováno v:
Scripta Materialia. 209:114383
We report the existence of universal behavior of a mobile thermal groove in polycrystalline thin films using a novel three-dimensional phase-field model. The universal behavior is independent of film thickness, surface diffusivity and grain boundary
Autor:
Rajdip Mukherjee, T.A. Abinandanan
Publikováno v:
Computational Materials Science. 203:111076
Autor:
Miral Verma, Rajdip Mukherjee
Publikováno v:
Journal of Applied Physics. 130:025305
Grain boundary grooving significantly affects the grain growth behavior in a polycrystalline thin film with columnar grain structure by partial or complete pinning of moving grain boundaries. Theoretically, it can be shown that the stagnation of grai
Publikováno v:
Journal of Electronic Materials. 45:6233-6246
In the present work, we study the phenomenon of grain-boundary grooving under electromigration using a phase-field method. The specific focus of the work is to explore the role of grain boundaries as potential electromigration pathways. We consider t
Autor:
Rupesh Chafle, Rajdip Mukherjee
Publikováno v:
Materials Letters. 279:128444
Elastic fields affect the late-stage coarsening behavior in Ni-based superalloys during their service conditions. Their high-temperature properties are attributed to the stable γ - γ ' morphology. Elasticity can alter the coarsening dynamics of suc
Autor:
Rajdip Mukherjee, Miral Verma
Publikováno v:
Journal of Alloys and Compounds. 835:155163
During dewetting of a solid-state thin film on a substrate, the film tends to agglomerate into islands to reduce its total interfacial energy, which can be utilized as an economical pattern formation technique. In this work, we are using a three-dime
Publikováno v:
Computational Materials Science. 108:342-347
We numerically investigate the characteristics of concurrent carbon redistribution pathways, as the ferrite–austenite front evolves during an isothermal eutectoid transformation starting from a random distribution of preexisting cementite particle.