Zobrazeno 1 - 10
of 27
pro vyhledávání: '"Rajaguru, Pushparajah"'
Autor:
Hassan, Sheikh, Rajaguru, Pushparajah, Stoyanov, Stoyan, Bailey, Christopher, Tilford, Timothy
Publikováno v:
In Power Electronic Devices and Components August 2024 8
Autor:
Rajaguru, Pushparajah
The principal aim of this PhD program is the development of an optimisation and risk based methodology for reliability and robustness predictions of packaged electronic components. Reliability based design optimisation involves the integration of red
Externí odkaz:
http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.646801
Publikováno v:
In Microelectronics Reliability November 2015 55(11):2371-2381
Publikováno v:
In Microelectronics Reliability May 2015 55(6):919-930
Publikováno v:
8th International Conference on Information Technology Trends
Digital twin and artificial intelligence technologies have proliferated as crucial enablers for Industry 4.0. With a digital twin, companies can digitally test and validate a product before it exists in the real world. By digitally recreating the pla
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d92790f176ce46cdd675364c0f2d3ace
https://doi.org/10.1109/itt56123.2022.9863938
https://doi.org/10.1109/itt56123.2022.9863938
Publikováno v:
In International Journal of Fatigue December 2012 45:61-70
Publikováno v:
2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Predicting the reliability of power electronics module wirebond structures requires accurate computer models to investigate the design space constraints in a computationally efficient manner. This paper details a model-order reduction (MOR) method to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2f6697a39cd97782f3b5fd4313c588d0
https://doi.org/10.1109/therminic52472.2021.9626396
https://doi.org/10.1109/therminic52472.2021.9626396
Autor:
Ortiz Gonzalez, Jose Angel, Alatise, Olayiwola M., Ran, Li, Mawby, P. A. (Philip A.), Rajaguru, Pushparajah, Bailey, Christopher
Fast switching SiC Schottky diodes are known to exhibit significant output oscillations and electromagnetic emissions in the presence of parasitic inductance from the package/module connections. Furthermore, solder pad delamination and wirebond lift-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=core_ac_uk__::bdcc4f6ed35f890d828f41300fdea59f
http://wrap.warwick.ac.uk/86129/1/WRAP_engineering-210217-pid4330033_lr.pdf
http://wrap.warwick.ac.uk/86129/1/WRAP_engineering-210217-pid4330033_lr.pdf
Akademický článek
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Autor:
Ortiz Gonzalez, Jose, Alatise, Olayiwola, Aliyu, Attahir Murtala, Rajaguru, Pushparajah, Castellazzi, Alberto, Ran, Li, Mawby, Philip A., Bailey, Chris
Publikováno v:
IEEE Transactions on Industrial Electronics; Oct2017, Vol. 64 Issue 10, p8213-8223, 11p