Zobrazeno 1 - 10
of 82
pro vyhledávání: '"Raja Sekhar Dondapati"'
Publikováno v:
Engineering Science and Technology, an International Journal, Vol 24, Iss 2, Pp 589- (2021)
Externí odkaz:
https://doaj.org/article/0d938df02c434c8da936565e7dacc5d7
Publikováno v:
Engineering Science and Technology, an International Journal, Vol 20, Iss 6, Pp 1676-1679 (2017)
Supercritical fluid technology finds its application in almost all engineering aspects in one or other way. Technology of clean jet fuel combustion is also seeing supercritical fluids as one of their contender in order to mitigate the challenges rela
Externí odkaz:
https://doaj.org/article/4eaf66afe3a14b4381655d2b6fc5eda4
Publikováno v:
Evergreen. 10:421-429
The technical advantages of using evaporative cooling have drawn the attention of many researchers and industrialist in the world. Moreover, evaporative cooling techniques have been found to be most promising alternative to the HVAC methods in variou
Publikováno v:
Lecture Notes in Mechanical Engineering ISBN: 9789811921872
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47794357634a072a46a92d8411849b75
https://doi.org/10.1007/978-981-19-2188-9_66
https://doi.org/10.1007/978-981-19-2188-9_66
Autor:
Raja Sekhar, Dondapati, Rao, V.V.
Publikováno v:
In Cryogenics February 2013 54:20-29
Publikováno v:
International Journal of Vehicle Structures and Systems. 14
Microchannel heat sinks (MCHS) have been found to be showing better performance in terms of heat transfer rates at a penalty of pressure drop. This higher-pressure drop would contribute to the requirement of higher pumping power. In this work, an inv
Publikováno v:
Springer Tracts in Additive Manufacturing ISBN: 9783030752347
3D printing (3DP) is one of the emerging technology in 21th century and popular in academics and industries. Wide range of materials printed by 3DP and it should be noted that the flexibility of 3DP materials comes from the range of 3DP systems and t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6afe61a4985e2dab2140a99435c5b037
https://doi.org/10.1007/978-3-030-75235-4_2
https://doi.org/10.1007/978-3-030-75235-4_2
Autor:
Gaurav Vyas, Raja Sekhar Dondapati
Publikováno v:
2021 International Conference on Simulation, Automation & Smart Manufacturing (SASM).
Publikováno v:
2021 International Conference on Simulation, Automation & Smart Manufacturing (SASM).
Publikováno v:
JP Journal of Heat and Mass Transfer. 18:225-232