Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Raj Pendse"'
Improvement of ELK Reliability in Flip Chip Packages using Bond-on-Lead (BOL) Interconnect Structure
Publikováno v:
International Symposium on Microelectronics. 2010:000197-000203
In this paper, a novel flip chip interconnect structure called Bond-On-Lead (BOL) and its ability to reduce stress in the sensitive sub-surface ELK (Extra Low K) layers of the die is presented. BOL is a new low cost flip chip packaging solution which
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::790e7bb2b7205178ae0c0f0b2aea0d15
https://doi.org/10.4071/isom-2010-tp2-paper1
https://doi.org/10.4071/isom-2010-tp2-paper1
Autor:
Raj Pendse
Publikováno v:
IEEE International Interconnect Technology Conference.
Moore's law has been the foundation for increasing complexity and density of semiconductor chips and has prevailed over the years through many transitions in silicon (Si) nodes. The simultaneous scaling of density, cost and performance which is made
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0b4a490d29ab9712c7782a5bc8001eb8
https://doi.org/10.1109/iitc.2014.6831844
https://doi.org/10.1109/iitc.2014.6831844
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
The market for portable and mobile data access devices connected to a virtual cloud access point is exploding and driving both increased functional convergence as well as increased packaging complexity and sophistication. This is driving an unprecede
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::77894a4b8ed6253c9c5b249d348f50ce
https://doi.org/10.1109/ectc.2013.6575830
https://doi.org/10.1109/ectc.2013.6575830
Autor:
Mohan Nagar, A. Bansal, Choi HangChul, John Savic, Raj Pendse, Weidong Xie, Lee SangHo, Park Gun Oh, Mudasir Ahmad, David Senk, Nokibul Islam
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
High speed network packaging solutions have pushed the limits of known manufacturing technology into previously untested realms. Next generation ASIC's and SiP/MCM's are requiring packages in excess of 60mm × 60mm. These large package sizes present
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4e767c3bfb6ed51c9e726d7199350272
https://doi.org/10.1109/ectc.2012.6248870
https://doi.org/10.1109/ectc.2012.6248870
Autor:
C H Cho, S S Kim, P. Kim, Raj Pendse, C. Palar, HunTeak Lee, Mukul Joshi, S H Kim, R. Martin, K.M. Kim, K. Lee, A. Murphy, V. Pandey
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
A new low cost flip chip (LCFC) packaging solution is developed that dramatically reduces flip chip package cost. The solution entails innovations and improvements in the bump, interconnect structure, substrate design and underfilling process. Cu col
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e38d622e688ecb3718a9660d41e08640
https://doi.org/10.1109/ectc.2010.5490872
https://doi.org/10.1109/ectc.2010.5490872
Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
A no-flow underfill (NFU) process has been developed using a 11.5 /spl times/ 11.5 mm graphics device in a 35 /spl times/ 35 mm BGA package. Commonly known problems in NFU processing such as, "die floating" and "filler trapping" were resolved using a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b93fcc2843a3635d24bbf6196bb338a
https://doi.org/10.1109/ectc.2005.1441281
https://doi.org/10.1109/ectc.2005.1441281
Autor:
Raj Pendse, J.S. Yun, T. Lau, M. Michael, O. Starr, B. Jafari, Inderjit Singh, B. Zahn, T. Dewey, M.H. Yee, B. Marcus
Publikováno v:
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
A flip-chip multi-chip module has been developed for NVidia's mobile AGP processor (MAP) family of integrated graphics subsystem products. The graphics subsystem consists of a high-end graphics processing unit (GPU) chip, four high-speed DDR memory c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4cd7b0390e435d5185739aa9afd97751
https://doi.org/10.1109/ectc.2004.1319308
https://doi.org/10.1109/ectc.2004.1319308
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