Zobrazeno 1 - 10
of 119
pro vyhledávání: '"Rainer Dudek"'
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc495502df3e87501a57376f0abe1ca5
https://doi.org/10.1109/eurosime56861.2023.10100806
https://doi.org/10.1109/eurosime56861.2023.10100806
Autor:
Bart Vandevelde, Riet Labie, Ralph Lauwaert, Rainer Dudek, Przemyslaw Gromala, Michael Eichorst
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb036dc1720277aed4d5d75030e9f27b
https://doi.org/10.1109/eurosime56861.2023.10100841
https://doi.org/10.1109/eurosime56861.2023.10100841
Publikováno v:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::70447937a7c72b74cc73eb7f37252985
https://doi.org/10.1109/itherm54085.2022.9899589
https://doi.org/10.1109/itherm54085.2022.9899589
Autor:
Bart Vandevelde, Chinmay Nawghane, Rainer Dudek, Ralf Doring, Jens Schindele, Przemyslaw Gromala
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5890fcacf82d6d5df6040a52b385e6c
https://doi.org/10.1109/eurosime54907.2022.9758850
https://doi.org/10.1109/eurosime54907.2022.9758850
Publikováno v:
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
The thermomechanical reliability of the package and interconnections of assembled flip chip ball grid arrays (FC-BGA) is investigated in comparison to a reference chip scale package (CSP). Comparison is made using finite element (FE-) simulation. A c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e78af32c797fbe98c78005fdd7122208
https://doi.org/10.1115/ipack2021-73970
https://doi.org/10.1115/ipack2021-73970
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Aluminum based wire-bonds are still representing the most important technology for the chip top side connection in power devices. At the same time, they often limit the reliability and lifetime of the overall power device or module. Hence, knowledge
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::325bade3e9178add867331ae210b789e
https://doi.org/10.1109/itherm51669.2021.9503206
https://doi.org/10.1109/itherm51669.2021.9503206
Autor:
R. Doring, Rainer Dudek, Schindele Jens, Bart Vandevelde, Sven Rzepka, Przemyslaw Jakub Gromala
Publikováno v:
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
The use of electronics for purpose of autonomous driving requires high performance vehicle computer (HPVC) systems usable in harsh environments. A variety of challenging issues have to be considered from different perspectives. The paper focuses on t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b4b4d2b6db3549cf2793d6cc64726964
https://doi.org/10.1109/eurosime52062.2021.9410854
https://doi.org/10.1109/eurosime52062.2021.9410854
Autor:
Sven Rzepka, Christina Scherf, Rainer Dudek, Nilavazhagan Subbiah, Jürgen Wilde, J. Albrecht, Anu Mathew
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
Silver sintering technology has been introduced as a replacement for the traditional interconnect technology such as soldering on power modules. Solder fatigue and wire bond failures are two major factors that affects the lifetime of power modules. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::221c9915eff55aaf161f12e61b3c12eb
https://doi.org/10.1109/estc48849.2020.9229761
https://doi.org/10.1109/estc48849.2020.9229761
Publikováno v:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
In modern microelectronic devices, mechanical robustness and reliability have become more and more challenging, which is mainly due to continuous shrinkage of dimensions. At the same time a wide variety of thin film materials – metals, ceramics and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8537da93012e0699f0ce78961d8cce8e
https://doi.org/10.1109/eurosime48426.2020.9152755
https://doi.org/10.1109/eurosime48426.2020.9152755
Autor:
R. W. Ortmann, S. Rzepka, L. Scheiter, R. Doring, Rainer Dudek, K. Kreysig, Marcus Hildebrandt, M. Zhang
Publikováno v:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Reliability is an obvious requirement in particular for the developing use of automotive electronics towards autonomous driving. Micro-electronics must also stay reliable in mounting situations, denoted as “3rd level reliability”, which has been
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9fcc7778be879bd6b816cd83a5406f67
https://doi.org/10.1109/eurosime48426.2020.9152623
https://doi.org/10.1109/eurosime48426.2020.9152623