Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Rahul N. Manepalli"'
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Intel's Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnects of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cdf32a84d5a555c69805327a9718862a
https://doi.org/10.1109/ectc32696.2021.00012
https://doi.org/10.1109/ectc32696.2021.00012
Autor:
Timothy Huang, Rahul N. Manepalli, Rao Tummala, Venky Sundaram, Himani Sharma, Kandanur Sashi S
Publikováno v:
Journal of Electronic Materials. 47:7401-7408
In this study, individual interactions between various classes of organic additives in electrolytic copper plating solutions are characterized by electroanalytical methods. Cyclic voltammetry and chronopotentiometry were used to compare cases of sequ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::205175c2e51d72e40001e22638a49cfd
https://doi.org/10.1007/s11664-018-6680-0
https://doi.org/10.1007/s11664-018-6680-0
Autor:
Nasrin Hooshmand, Rahul N. Manepalli, Himani Sharma, Rao Tummala, Bartlet H. DeProspo, Nithin Nedumthakady, Sajanlal R. Panikkanvalappil, Kandanur Sashi S
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
To meet demand for increasingly higher-performance electronics in increasingly smaller form factors, achieving higher logic-memory bandwidth and higher I/O density is required. This necessitates finer copper lines, smaller copper microvias, and fine-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d9801bd46715e56f0f6e4663580e8245
https://doi.org/10.1109/ectc.2019.00244
https://doi.org/10.1109/ectc.2019.00244
Autor:
Kousik Ganesan, Thomas Heaton, Suddhastawa Nad, Chandrasekhar Pendyala, Rahul N. Manepalli, Amaneh Tasooji, Radek P. Chalupa, Marcel A. Wall, Yang Sun
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Low cost electroplating of copper to create Fine Line Space (FLS) features and Blind Micro Via's (BMV) is a key technology element of high density substrates for integrated circuit packaging. There is a critical need to provide uniform copper metal d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e45677cf9b747dbcc0b86b95d9ba937
https://doi.org/10.1109/ectc.2017.87
https://doi.org/10.1109/ectc.2017.87