Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Rafael Follmann Faccenda"'
Publikováno v:
IEEE Access, Vol 11, Pp 131836-131847 (2023)
Many-core Systems-on-Chip (MCSoC) are increasingly used in various applications domains such as high-performance computing, embedded systems, and Internet of Things devices. As MCSoCs permeate various industries and applications, the potential conseq
Externí odkaz:
https://doaj.org/article/3a7eb5bde5634a07b7360ceeb3218b42
Publikováno v:
IEEE Access, Vol 9, Pp 153142-153152 (2021)
The modularization and manufacture of many-cores system-on-chip that involve several vendors open up a vulnerability: the inclusion of Hardware Trojans (HT). In addition to that, the reduced feature size of transistors may accelerate aging effects, l
Externí odkaz:
https://doaj.org/article/85f3cb83e25c4210b0785da5289a54a8
Publikováno v:
Journal of Integrated Circuits and Systems. 16:1-15
The adoption of many-cores systems introduces the concern for data protection as a critical design requirement due to the resource sharing and the simultaneous executions of several applications on the platform. A secure application that processes se
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d46a331eaefb6a741f767b9470f99622
https://doi.org/10.29292/jics.v16i2.485
https://doi.org/10.29292/jics.v16i2.485
Publikováno v:
2022 35th SBC/SBMicro/IEEE/ACM Symposium on Integrated Circuits and Systems Design (SBCCI).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ea24892cc1c2c540bfec149afa181f1
https://doi.org/10.1109/sbcci55532.2022.9893244
https://doi.org/10.1109/sbcci55532.2022.9893244
Publikováno v:
IEEE Access, Vol 9, Pp 153142-153152 (2021)
The modularization and manufacture of many-cores system-on-chip that involve several vendors open up a vulnerability: the inclusion of Hardware Trojans (HT). In addition to that, the reduced feature size of transistors may accelerate aging effects, l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::dd3f9c7b2dc7a3183aa4cb20eedf62c7
https://ieeexplore.ieee.org/document/9612218/
https://ieeexplore.ieee.org/document/9612218/
Publikováno v:
IEEE Design & Test. :1-1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a4914061807134b1df9ce0d442f5f5b
https://doi.org/10.1109/mdat.2023.3277813
https://doi.org/10.1109/mdat.2023.3277813
Autor:
Carlos Gabriel de Araujo Gewehr, Antonio Carlos Schneider Beck, Rafael Follmann Faccenda, Mateus Beck Rutzig
Publikováno v:
SBCCI
Embedded systems have been demanding massive parallel computing encapsulated inside one single chip. As more cores are integrated into a single chip, higher bandwidth must be available, which conflicts with severe power constraints of embedded device
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7f2dc741ebd37c1b80138fd36eaf093
https://doi.org/10.1109/sbcci50935.2020.9189924
https://doi.org/10.1109/sbcci50935.2020.9189924
Publikováno v:
SBESC
The increasing integration of many processing elements inside the same die has been raising the need to create efficient communication infrastructures. Different structures have been exploited to interconnect those elements, such as NoCs, crossbars a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7a2fd5d4fd888e95194f3506439efefe
https://doi.org/10.1109/sbesc.2018.00043
https://doi.org/10.1109/sbesc.2018.00043