Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Raed AL Athamneh"'
Publikováno v:
Scientific Reports, Vol 13, Iss 1, Pp 1-19 (2023)
Abstract The accuracy of reliability models is one of the most problematic issues that must be considered for the life of electronic assemblies, particularly those used for critical applications. The reliability of electronics is limited by the fatig
Externí odkaz:
https://doaj.org/article/be30b0b692cf4b94b5ea588bcee7af1d
Autor:
Raed AL Athamneh, Moayad Tanash, Dania Bani Hani, Mustafa Rawshdeh, Abdallah Alawin, Zaid Albataineh
Publikováno v:
Operations Research Perspectives, Vol 11, Iss , Pp 100286- (2023)
In distribution systems such as airlines and express package delivery, the use of hub-and-spoke networks is common, and flow consolidation at hub facilities is essential for cost reduction. While a constant discount factor is typically used to model
Externí odkaz:
https://doaj.org/article/505851cdf51a4ba2a99854742149a3f3
Publikováno v:
Scientific Reports, Vol 13, Iss 1, Pp 1-13 (2023)
Abstract Reliability of the microelectronic interconnection materials for electronic packages has a significant impact on the fatigue properties of the electronic assemblies. This is due to the correlation between solder joints reliability and the mo
Externí odkaz:
https://doaj.org/article/59fcadedd45a44febbcbd9e6ad7c7996
Publikováno v:
Scientific Reports, Vol 12, Iss 1, Pp 1-11 (2022)
Abstract This study focuses on channel estimation for reconfigurable intelligent surface (RIS)-assisted mmWave systems, in which the RIS is used to facilitate base-to-user data transfer. For beamforming to work with active and passive elements, a lar
Externí odkaz:
https://doaj.org/article/2310e6a5c04b4993b7a62d38b269fdea
Publikováno v:
Scientific Reports, Vol 13, Iss 1, Pp 1-2 (2023)
Externí odkaz:
https://doaj.org/article/b969cdd865e04d96b685d685b0e38d3d
Publikováno v:
Crystals, Vol 12, Iss 9, p 1306 (2022)
The failure of one solder joint out of the hundreds of joints in a system compromises the reliability of the electronics assembly. Thermal cycling is a result of both creep–fatigue mechanisms working together. To better understand the failure proce
Externí odkaz:
https://doaj.org/article/c7ffec3d950746409cb070848c365413
Publikováno v:
Crystals, Vol 12, Iss 6, p 775 (2022)
The mechanical and fatigue properties of microelectronic interconnection materials are important issues in critical applications in the life of electronic assemblies. Due to the growth in the applications of electronic components in new technological
Externí odkaz:
https://doaj.org/article/8fba4ddab2d443c8b98cea1cba240e40
Publikováno v:
Crystals, Vol 12, Iss 4, p 457 (2022)
Aluminum alloys use is so profound in many applications such as transportation, construction, energy, defense applications, automotive, aerospace, to name a few. Therefore, investigating the mechanical and electrical properties of the different types
Externí odkaz:
https://doaj.org/article/5e0ad210d5fb44ee831a6da259a2cbff
Autor:
Mustafa Rawshdeh, Heather Keathley, Shahed Obeidat, Raed Al Athamneh, Mumen Rababah, Sandy Furterer
Publikováno v:
Engineering Management Journal. :1-14
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c1b4c83e00f0f2a8de26fe225e39358a
https://doi.org/10.1080/10429247.2023.2210493
https://doi.org/10.1080/10429247.2023.2210493
Autor:
Ibrahim Altawil, Mohammad Awad Momani, Mahamood A. Al-Tahat, Raed Al Athamneh, Mohammed Adnan Al-Saadi, Zaid Albataineh
Problems with voltage and stability have arisen as a result of the dramatic development in renewable energy generating units, notably solar energy systems linked to low and medium voltage networks, and the influence of active loads that vary rapidly
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d43c567201536074bcbd0ab67719de67
https://zenodo.org/record/7773421
https://zenodo.org/record/7773421
