Zobrazeno 1 - 1
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pro vyhledávání: '"Rachid Lamsairhri"'
Publikováno v:
SiliconPV Conference Proceedings, Vol 1 (2024)
For shingle interconnection there is no standard method to characterize the mechanical strength of the shingled joints. Therefore, we studied a die shear test for this purpose. In the first part, a single epoxy-based electrically conductive adhesive
Externí odkaz:
https://doaj.org/article/dcd1daf82c4c4fcb8019232f55d10f9b
