Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Raahul Palanivel Uma"'
Autor:
Timon Rabczuk, Mohammad Reza Azadi Kakavand, Raahul Palanivel Uma, Ali Hossein Nezhad Shirazi, Meysam Makaremi
Publikováno v:
Energies, Vol 11, Iss 6, p 1553 (2018)
We carried out molecular dynamics simulations at various temperatures to predict the thermal conductivity and the thermal conductance of graphene and hexagonal boron-nitride (h-BN) thin films. Therefore, several models with six different grain bounda
Externí odkaz:
https://doaj.org/article/6984ae1f649a41ab834ca1d623ca3985
Autor:
Ali Hossein Nezhad Shirazi, Mohammad Reza Azadi Kakavand, Meysam Makaremi, Timon Rabczuk, Raahul Palanivel Uma
Publikováno v:
Energies
Volume 11
Issue 6
Energies, Vol 11, Iss 6, p 1553 (2018)
Volume 11
Issue 6
Energies, Vol 11, Iss 6, p 1553 (2018)
We carried out molecular dynamics simulations at various temperatures to predict the thermal conductivity and the thermal conductance of graphene and hexagonal boron-nitride (h-BN) thin films. Therefore, several models with six different grain bounda
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::91563b701f51175d24837dff50b62e96
In this paper, we investigate the effect of temperature and grain size on the mechanical response of atomistic polycrystalline structures through classical molecular dynamic (MD) simulations. Five samples with different grain sizes in the range of 2
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7420fc45d8c84ef2cbeee1319887dfc0
https://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&origin=inward&scp=85012060315
https://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&origin=inward&scp=85012060315
In this paper, molecular dynamic simulations are utilized to investigate the effect of temperature and topological defects on the mechanical response and tensile strength of grain boundaries in single-layer hexagonal boron-nitride (h-BN) nanosheets.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e2f298bd9a45782ece8b60d804026434
https://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&origin=inward&scp=84978701002
https://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&origin=inward&scp=84978701002