Zobrazeno 1 - 10
of 39
pro vyhledávání: '"Ra-Min Tain"'
Autor:
Chi Chuan Wang, Ra Min Tain
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 22:205-208
Autor:
Ra-Min Tain, Yu-Hua Chen, Kai-Ming Yang, D.-S. Liu, Chen-Hao Lin, Jui-Tang Chen, Dyi-Chung Hu
Publikováno v:
International Symposium on Microelectronics. 2016:000282-000287
Applications of Glass substrate for high performance system-in-package (SiP) products have gradually become a promising technology in recent years. Research and development activities are reported in many journal papers and conferences [1,2]. Consort
Autor:
Henry Yang, Yu-Min Lin, Yin-Po Hung, Wei-Chung Lo, Chih-Kung Yang, Hsiang Hung Chang, Yu-Hua Chen, Dyi-Chung Hu, Tao-Chih Chang, Ra-Min Tain
Publikováno v:
International Symposium on Microelectronics. 2015:1-5
A new concept of packaging platform calls eHDF (embedded high density film), that without any TXVs is been proposed. The eHDF uses the technology from two categories; one utilize the semiconductor fine line technology infrastructure and the other tak
Autor:
Yu-Mei Cheng, Ren-Shing Cheng, Li-Ling Liao, Jui-Feng Hung, Yu-Lin Chao, Ra-Min Tain, Ming-Ji Dai, Yu-Wei Huang, Heng-Chieh Chien, Chun-Hsien Chien, Wei-Chung Lo, Chau-Jie Zhan, Ching-Kuan Lee, Ming-Jer Kao, Sheng-Tsai Wu, John H. Lau
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 4:1407-1419
In this investigation, a system-in-package (SiP) that consists of a very low-cost interposer with through-silicon holes (TSHs) and with chips on its top and bottom sides (a real 3-D IC integration) is studied. Emphasis is placed on the fabrication of
Autor:
Chih-Lun Wang, Ra-Min Tain, Zih-Yu Ciou, Yan-bin Chang, Meng-Fan Chang, Cheng-Hsiung Wang, Kai-Ming Yang, Dyi-Chung Hu, Yu-Hua Chen, Han-Wen Hu, Ching Chang
Publikováno v:
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
This paper is to present an assembly structure of system-in-package (SiP) module using the glass substrate with through-glass via (TGV) where the diameter of TGV is 100μm and the glass substrate is 200μm thick. The glass-substrate is first laminate
Autor:
Chii Rong Yang, Da-Jeng Yao, Chun Kai Liu, Heng Chieh Chien, Ra Min Tain, Ming Ji Dai, Li-Ling Liao
Publikováno v:
Applied Thermal Engineering. 51:75-83
Because of a lack of appropriate methods and the difficulties of sample preparation, few direct measurements of the thermal conductivity of thermoelectric materials in thin films have been reported. We prepared thermoelectric thin films of four types
Autor:
Heng-Chieh Chien, Ra-Min Tain, Chun-Hsien Chien, Ming-Ji Dai, Wei-Chung Lo, Yung-Jean Rachel Lu
Publikováno v:
International Symposium on Microelectronics. 2013:000611-000617
In this study, we used simulation technique to analyze the thermal characteristics of solo TGV (through-glass via) structure and solo TSV (through-silicon via) structure. The analysis showed, no matter in in-plane direction or in cross-plane directio
Autor:
Heng-Chieh Chien, Ra-Min Tain, John H. Lau, Sheng-Tsai Wu, Peng Su, Yu-Lin Chao, Li Li, M. Brillhart, Jie Xue
Publikováno v:
International Symposium on Microelectronics. 2012:001038-001045
In this study, the nonlinear thermal stress distributions at the Cu-low-k pads of Moore's law chips and creep strain energy density per cycle at the solder joints of a 3D IC integration system-in-package (SiP) are investigated. At the same time, the
Autor:
Sheng-Tsai Wu, Heng-Chieh Chien, Wei-Chung Lo, Ra-Min Tain, Sheng-Liang Li, Ming-Ji Dai, Yu-Lin Chao, Wei Li
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 5:75-84
Publikováno v:
Microelectronic Engineering. 88:779-784
The metal-insulator-metal (MIM) capacitor device is the most popular structure that has been massively used in system circuit designs in IC and PCB processes. The characteristics of system will be changed and electrical performances will be impaired