Zobrazeno 1 - 10
of 948
pro vyhledávání: '"RDL"'
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 12, Pp 96-103 (2024)
In advanced packaging schemes, such as fan-out integration technology, photosensitive polyimide (PSPI) is the key material to the fabrication of panel level redistribution-layer (RDL). However, a large mismatch of coefficient of thermal expansion (CT
Externí odkaz:
https://doaj.org/article/b2fecd3d8efb4b17813d3cc6743df56b
Autor:
Cong Chen, Sheng-Jye Cherng, Chuan He, Chih-Chun Chung, Sijia Wang, Yu-Ting Huang, Shien Ping Feng
Publikováno v:
Journal of Materials Research and Technology, Vol 27, Iss , Pp 4883-4890 (2023)
The redistribution layer (RDL) is crucial for fanning out circuits and for 2.5D/3D IC packaging. As device density increases, RDL CD/pitch must shrink. During RDL circuit fabrication, the etching process is necessary to remove the exposed sputtered C
Externí odkaz:
https://doaj.org/article/8b66810b588f4042992c528a0f6545f0
Publikováno v:
Agronomy, Vol 14, Iss 10, p 2249 (2024)
The rice stem borer (RSB) Chilo suppressalis is a devastating rice pest with resistance to a number of insecticides. Recently, the new meta-diamide insecticide cyproflanilide has been considered an effective insecticide to control RSB. However, its r
Externí odkaz:
https://doaj.org/article/e04de7e1670c41b08ca60ac4d5d66567
Publikováno v:
Micromachines, Vol 15, Iss 9, p 1127 (2024)
In this paper, we first build the 3D model of coaxial TSV(CTSV), RDL, and bump of the CTSV interconnect, and extract the equivalent circuit model of each part. Then, we get the S-parameters of the 3D and equivalent circuit model of the CTSV interconn
Externí odkaz:
https://doaj.org/article/889b4eea62514a2f96d0d19d538da386
Publikováno v:
Revista Iberoamericana de Bioética, Iss 22, Pp 1-15 (2023)
El acceso equitativo a las prestaciones sanitarias constituye uno de los principios del Sistema Nacional de Salud español. No obstante, se ha evidenciado la existencia de un porcentaje de ciudadanos que padecen dificultades económicas para adquirir
Externí odkaz:
https://doaj.org/article/36c10a079b32499c9b7991adc7fb5571
Publikováno v:
Microelectronics International, 2022, Vol. 40, Issue 2, pp. 104-108.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/MI-06-2022-0111
Autor:
Jiang Zhu, Ruipeng Chen, Juan Liu, Weichao Lin, Jiaxin Liang, Ralf Nauen, Suhua Li, Yulin Gao
Publikováno v:
Insects, Vol 15, Iss 3, p 194 (2024)
Potatoes hold the distinction of being the largest non-cereal food crop globally. The application of insecticides has been the most common technology for pest control. The repeated use of synthetic insecticides of the same chemical class and frequent
Externí odkaz:
https://doaj.org/article/96749bd6f5044b6bbf967a70f4789a10
Publikováno v:
Micromachines, Vol 15, Iss 3, p 376 (2024)
With the continuous development of advanced packaging technology in heterogeneous semiconductor integration, the delamination failure problem in a dynamic service environment has gradually become a key factor limiting the reliability of packaging dev
Externí odkaz:
https://doaj.org/article/fb97c1904e794607aed343fa2c4b0b84
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