Zobrazeno 1 - 10
of 60
pro vyhledávání: '"R.N. Master"'
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing. 32:106-114
The advanced flip-chip-in-package (FCIP) process technology, using no-flow underfill material for high I/O density (over 3000 I/O) and fine-pitch (down to 150 mum) interconnect applications, presents challenges for flip chip processing because underf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8b949a85df57717b655802de67d5d469
https://doi.org/10.1109/tepm.2009.2015592
https://doi.org/10.1109/tepm.2009.2015592
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing. 31:297-305
The advanced flip chip in package (FCIP) process using no-flow underfill material for high I/O density and fine-pitch interconnect applications presents challenges for an assembly process that must achieve high electrical interconnect yield and high
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5bf3aef438aba7cc31ef0561efeb5ce4
https://doi.org/10.1109/tepm.2008.2002951
https://doi.org/10.1109/tepm.2008.2002951
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 4:86-91
A generalized plane strain condition is assumed for an edge interfacial crack between die passivation and underfill on an organic substrate flip chip package. C4 solder bumps are explicitly modeled. Temperature excursions are treated as loading condi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::810acfb0f05fa02cf2a52226e32f8497
https://doi.org/10.1109/tdmr.2003.822339
https://doi.org/10.1109/tdmr.2003.822339
Akademický článek
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Publikováno v:
2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits.
This paper studied the factors of causing adhesion failure between lid and adhesive. Adhesive curing mechanism has been experimentally investigated in combination of surface behaviour analysis on lid by using FTIR and XPS. The results showed residue
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6bb27f6611078df75c35bb35c5cadff2
https://doi.org/10.1109/ipfa.2008.4588171
https://doi.org/10.1109/ipfa.2008.4588171
Autor:
R.N. Master
Publikováno v:
2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits.
As the demand for computing performance and density increases, the demand for packaging microprocessors is getting more complex. Computing speed and increased functionalities are achieved by reducing lithography features and increasing no. of transis
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2fd220b8053135dbf3484c24c12beedf
https://doi.org/10.1109/ipfa.2008.4588143
https://doi.org/10.1109/ipfa.2008.4588143
Publikováno v:
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
In flip-chip package, the mismatch of thermal expansion coefficients between the silicon die, copper heat spreader and packaging substrate induces concentrated stress field around the edges and corners of silicon die during assembly, testing and serv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64073106ba415023a50b5f9a398a37e1
https://doi.org/10.1109/itherm.2008.4544343
https://doi.org/10.1109/itherm.2008.4544343
Publikováno v:
2007 Proceedings 57th Electronic Components and Technology Conference.
The application of no-flow underfills for high IO density, fine-pitch, flip chip in package (FCIP) applications is analyzed. A number of commercially developed no flow underfills are evaluated. Process parameters for improved assembly yields depend s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e38b44a88e29ec9dcb769b50777b08d4
https://doi.org/10.1109/ectc.2007.373773
https://doi.org/10.1109/ectc.2007.373773
Publikováno v:
2005 7th Electronic Packaging Technology Conference.
Voids in flip chip packaging of organic land grid array (OLGA) caused by the inclusion of air, other gases and moisture were studied and experiments were designed to understand the cause of void formation. Reactions among the solder mask, flux residu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cd962b3b5c6083e437d088a077cf66ee
https://doi.org/10.1109/eptc.2005.1614495
https://doi.org/10.1109/eptc.2005.1614495
Publikováno v:
4th Electronics Packaging Technology Conference, 2002..
With increasing applications of thin multi-layer flip chip packages with complex interweaving layout, the difficulties and ineffectiveness of fault isolation with current nondestructive techniques such as RTX (real time X-ray) and SAM (scanning acous
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cd04009ed04e0f00f2c2daf6e24df5d0
https://doi.org/10.1109/eptc.2002.1185596
https://doi.org/10.1109/eptc.2002.1185596