Zobrazeno 1 - 10
of 36
pro vyhledávání: '"R.L. Shook"'
Autor:
B.D. Potteiger, John Michael DeLucca, R.L. Shook, Ahmed Amin, Frank A. Baiocchi, John William Osenbach
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing. 30:23-35
The microstructure and crystal structure of condensation-induced corrosion products, vapor phase induced oxidation products, Cu-Sn intermetallics, and Sn whiskers that formed on electroplated matte Sn on Cu-alloy after exposure 2500 h in a 60 degC/93
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::93508d6b92490566319e43889e70c62f
https://doi.org/10.1109/tepm.2006.890637
https://doi.org/10.1109/tepm.2006.890637
Autor:
P. Suratkar, Brian T. Vaccaro, R.L. Shook, B.D. Potteiger, P. Ruengsinsub, Ahmed Amin, K.N. Hooghan, John William Osenbach
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing. 28:36-62
Replacement of Pb/Sn terminations on electronic devices with pure Sn has proven to be much more difficult than expected. The main problem is Sn whisker formation. Sn whiskers are typically single-crystal, mechanically strong, metallic filaments that
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1afb0377487782b24ffd1ac59f056c00
https://doi.org/10.1109/tepm.2005.847438
https://doi.org/10.1109/tepm.2005.847438
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C. 19:110-118
Recent industry specifications JESD22-A112 and IPC-SM-786A have identified a set of moisture sensitivity levels for classification of moisture/reflow sensitive devices. The established test conditions are meant to represent average worst-case factory
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dfbabf3053dd0b3bfd2b2d8dff3c4148
https://doi.org/10.1109/3476.507147
https://doi.org/10.1109/3476.507147
Autor:
R.L. Shook, P. Ruengsinsub, Ahmed Amin, B.D. Potteiger, Brian T. Vaccaro, John William Osenbach
Publikováno v:
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
Replacement of Pb/Sn terminations on electronic devices with pure Sn has proven to be much more difficult than expected. The main problem is Sn whisker formation. Sn whiskers are single crystal, mechanically strong, metallic filaments that can nuclea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ef480124713487c53d392366c433500
https://doi.org/10.1109/ectc.2004.1320283
https://doi.org/10.1109/ectc.2004.1320283
Autor:
C. Horvath, A. Dairo, R.L. Shook, J.J. Gilbert, Brian T. Vaccaro, D.L. Gerlach, D.L. Crouthamel, G.J. Libricz, E. Thomas
Publikováno v:
53rd Electronic Components and Technology Conference, 2003. Proceedings..
The critical interplay of ingressed moisture, peak reflow temperature, package materials, and the resultant warpage behavior is shown to directly affect the board mount assembly capability of large body size plastic ball grid array (PBGA) packages. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::25c64054c26a69fb3ccb825ca97f7d15
https://doi.org/10.1109/ectc.2003.1216551
https://doi.org/10.1109/ectc.2003.1216551
Autor:
J.P. Goodelle, R.L. Shook
Publikováno v:
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).
Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMDs). This work describes how the distribution of moisture within the molded plastic body of a SMD is an important variable for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bc7a00987540ffc4d0e4c55f4774a2f1
https://doi.org/10.1109/ectc.1999.776275
https://doi.org/10.1109/ectc.1999.776275
Autor:
T.R. Conrad, R.L. Shook
Publikováno v:
1994 Proceedings. 44th Electronic Components and Technology Conference.
Ambient moisture uptake in plastic surface mount IC packages can cause delamination of critical internal surfaces within the package during reflow assembly. Delaminations can result in reduced thermal cycling life performance or provide for a pathway
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3bb3ee17036fc00df77011ce0dea3dab
https://doi.org/10.1109/ectc.1994.367543
https://doi.org/10.1109/ectc.1994.367543
Influence of preheat and maximum temperature of the solder-reflow profile on moisture sensitive IC's
Autor:
V.S. Sastry, R.L. Shook
Publikováno v:
1997 Proceedings 47th Electronic Components and Technology Conference.
The purpose of this work was to determine the influence of preheat and maximum solder reflow temperature on the level of moisture induced damage in plastic surface mount integrated circuits. Both an analytical moisture diffusion model and Finite Elem
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3fdd1349ff313fb0e2994929958ad460
https://doi.org/10.1109/ectc.1997.606299
https://doi.org/10.1109/ectc.1997.606299
Autor:
R.L. Shook, C.M. Yang
Publikováno v:
1995 Proceedings. 45th Electronic Components and Technology Conference.
Results are summarized on the process compatibility for bottom-side wave soldering of eleven different 14 and 16-pin plastic encapsulated Small Outline Integrated Circuits (SOICs) in a Gull Wing foot print (SOGs). Devices were preconditioned to a sat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c19b06242354e821a574255c17f67728
https://doi.org/10.1109/ectc.1995.514364
https://doi.org/10.1109/ectc.1995.514364
Publikováno v:
1995 Proceedings. 45th Electronic Components and Technology Conference.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a06e74faf5d90e430128dec76f8e2598
https://doi.org/10.1109/ectc.1995.515319
https://doi.org/10.1109/ectc.1995.515319