Zobrazeno 1 - 10
of 26
pro vyhledávání: '"R.L. Keusseyan"'
This paper reviews the development of deformation models based on a state variable approach for nonelastic deformation. The material parameters required can be determined by a combination of load-relaxation and constant-displacement-rate tests. The e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f396ebdf962baab309977fb2542c8d4
https://doi.org/10.1520/stp28886s
https://doi.org/10.1520/stp28886s
Publikováno v:
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
Opto-electronic and MEMS packages require unique capabilities over and above traditional hermetic multichip modules. In addition to hermeticity or vacuum atmosphere, opto-electronic systems require direct input/output of optical, RF and other sensiti
Publikováno v:
Proceedings., 39th Electronic Components Conference.
Autor:
J.L. Dilday, R.L. Keusseyan
Publikováno v:
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).
The development of brazing interconnection technology to low thermal expansion glass-ceramics is discussed in detail. A two-paste thick-film metallization system which acts not only as a chemical barrier to the braze alloy, but also as a high-ductili
Publikováno v:
8th IEEE/CHMT International Conference on Electronic Manufacturing Technology Symposium.
Materials and processes have been developed for brazing pin, lead, window frame, and heat sink metals to alumina and glass ceramic substrates. The substrates are metallized using copper-, silver-, palladium/silver-, or gold-based thick-film pastes th
Publikováno v:
Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154).
A new "high density" gold thick film technology is introduced. Circuits produced using the new material system exhibit superior fine line definition, conductivity density and high frequency performance. The high frequency performance of etched "high
Publikováno v:
Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153).
Recognizing the need for improved materials data to meet the needs of designers of RF and microwave products, DuPont Photopolymers and Electronic Materials (P&EM) has had an ongoing program to generate high frequency data on materials properties (die
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 13:219-221
The development of materials and processes for brazing leads, pins, and heat sinks to alumina ceramic substrates is presented. The substrates are metallized using either copper-, silver-, or gold-based thick-film pastes that are fired in the 850-950
Publikováno v:
Journal of Nuclear Materials. 98:86-97
Load relaxation tests were performed on Zircaloy-2 and Zircaloy-4 sheets with varied textures and microstructures. Experimental data in the form of logarithmic stress versus logarithmic strain rate curves showed characteristics which can be used to i
Publikováno v:
Journal of Nuclear Materials. 80:390-392
The observation of creep damage in the form of grain boundary cavitation in Zircaloy-4 in the temperature range of interest to Light Water Reactor (LWR) applications is reported. The observed damage is shown to reduce the ductility of Zircaloy-4 in a