Zobrazeno 1 - 10
of 21
pro vyhledávání: '"R.E. Powell"'
Autor:
Victoria E. Langenheim, R.E. Powell
Publikováno v:
Geosphere. 5:1-22
The Eastern Transverse Ranges, adjacent to and southeast of the big left bend of the San Andreas fault, southern California, form a crustal block that has rotated clockwise in response to dextral shear within the San Andreas system. Previous studies
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f060072887a8a9dd0e798fb231673b83
https://doi.org/10.1130/ges00177.1
https://doi.org/10.1130/ges00177.1
Autor:
I.C. Ume, R.E. Powell
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing. 31:83-90
In this paper, a warpage measurement system to simulate forced convective reflow is discussed. A warpage measurement system that can simulate convective reflow enables the real-time monitoring of printed wiring boards (PWBs), PWB assemblies (PWBAs),
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::42023f4b39df0007931ca9134752f29c
https://doi.org/10.1109/tepm.2007.914220
https://doi.org/10.1109/tepm.2007.914220
Autor:
I.C. Ume, R.E. Powell
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 30:500-508
The shadow moire and projection moire techniques are widely used methods for measuring printed wiring board (PWB) and PWB assembly (PWBA) warpage. Both methods have high resolution, high accuracy and are suitable for use in an online environment. Whe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8167126e3e012f4c68a0b47dc8402134
https://doi.org/10.1109/tcapt.2007.900066
https://doi.org/10.1109/tcapt.2007.900066
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 28:517-524
Out-of-plane displacement (warpage) causes mis-registration, delamination, possibly solder joint opening(s), and other printed wiring board assembly (PWBA) failures during surface-mount assembly processes and life-span operations. Many material, geom
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fca3ecca47fe9bf8dd99ce7719c6a763
https://doi.org/10.1109/tcapt.2005.848570
https://doi.org/10.1109/tcapt.2005.848570
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 25:714-721
Microelectronic and photonic packaging are progressing toward integrating more devices with more functions into a smaller confined space, while requiring higher yield and superior reliability. New electronic components, materials, fabrication process
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b17b6bcb01475f7964381a2268094848
https://doi.org/10.1109/tcapt.2002.808010
https://doi.org/10.1109/tcapt.2002.808010
Autor:
R.E. Powell, I. Charles Ume
Publikováno v:
Journal of Electronic Packaging. 131
The shadow moiré technique is a widely used method of measuring printed wiring board (PWB) warpage. It has a high resolution, high accuracy, and is suitable for use in an online environment. The shortcoming of the shadow moiré technique is that it
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9aa4821af91f17fec9cef6d1e90d701a
https://doi.org/10.1115/1.3103938
https://doi.org/10.1115/1.3103938
Autor:
R.E. Powell, I.C. Ume
Publikováno v:
56th Electronic Components and Technology Conference 2006.
The shadow moire technique is a widely used method of measuring printed wiring board (PWB) warpage. It has a high resolution, high accuracy and is suitable for use in an online environment. The shortcoming of the shadow moire technique is that it can
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5fba6076de6db0ed5329d22f60dc278
https://doi.org/10.1109/ectc.2006.1645712
https://doi.org/10.1109/ectc.2006.1645712
Publikováno v:
Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology.
Warpage has long been known to cause thermomechanical reliability problems in electronic packaging. The coefficient of thermal expansion (CTE) mismatch between different materials in an electronic assembly such as solder, copper, FR-4, encapsulation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6797df1dc5052329a621dafcc842469e
https://doi.org/10.1115/imece2006-15678
https://doi.org/10.1115/imece2006-15678
Publikováno v:
Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology.
The shadow moire´ technique is a widely used method of measuring printed wiring board (PWB) warpage. It has a high resolution, high accuracy and is suitable for use in an online environment. A shortcoming of the shadow moire´ technique is that it c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba6374e73237df845886ab265f5e3ea9
https://doi.org/10.1115/imece2006-15682
https://doi.org/10.1115/imece2006-15682
Autor:
R.E. Powell, I. Charles Ume
Publikováno v:
Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology.
In this research, a warpage measurement system to simulate forced convective reflow is designed and developed. In order to design a system to simulate forced convective reflow, the system should be capable of heating a PWB at an average rate of 2 °C
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::38c02f456d25f84db1c0cc244b1d0385
https://doi.org/10.1115/imece2005-79975
https://doi.org/10.1115/imece2005-79975